Composition for forming touch panel electrode protective film, transfer film, transparent laminate, protective film for touch panel electrode and method for forming same, capacitive input device, and image display device

ABSTRACT

The composition contains a compound represented by Formula 1, a binder polymer, a photopolymerization initiator, and a monomer having a carboxy group, in which the content of the compound represented by Formula 1 is 5% by mass or more and less than 50% by mass with respect to the total mass of monomer components, and in Formula 1, Q 1  and Q 2  each represent a (meth)acryloyloxy group, and R 1  represents a divalent linking group having a chain-like structure.
 
Q 2 -R 1 -Q 1   (1)

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of PCT International Application No.PCT/JP2016/51379, filed on Jan. 19, 2016, which claims priority under 35U.S.C. § 119(a) to Japanese Patent Application No. 2015-036366, filed onFeb. 26, 2015. Each of the above application(s) is hereby expresslyincorporated by reference, in its entirety, into the presentapplication.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a composition for forming a touch panelelectrode protective film, a transfer film, a transparent laminate, aprotective film for a touch panel electrode, a method for forming theprotective film, a capacitive input device, and an image display device.

2. Description of the Related Art

In recent years, in electronic devices such as a mobile phone, a carnavigation, a personal computer, a ticket machine, and a terminal of abank, a tablet type input device is disposed on a surface of a liquidcrystal device or the like, and while referring to an instruction imagedisplayed on an image display region of the liquid crystal device, inputof information corresponding to the instruction image is performed bytouching a spot in which the instruction image is displayed with afinger or a touch pen. As such an input device (touch panel), aresistive film type input device and a capacitive input device are used.The capacitive input device has an advantage in that the input device ismanufactured simply by forming a light-transmissive conductive film onone substrate.

In recent years, it has been suggested, in regard to capacitive inputdevices (touch panels), to form a transparent resin layer having a highrefractive index on a transparent electrode pattern, in view of loweringvisibility of the transparent electrode.

For example, JP2014-108541A describes a transfer film including atemporary support, a first curable transparent resin layer, and a secondcurable transparent resin layer which is disposed adjacent to the firstcurable transparent resin layer, in this order, in which a refractiveindex of the second curable transparent resin layer is higher than arefractive index of the first curable transparent resin layer, and therefractive index of the second curable transparent resin layer is 1.6 orhigher; and capacitive input device prepared using the transfer film.

Furthermore, regarding a touch panel protective film, JP2014-206574Adescribes a photosensitive resin composition containing aphotopolymerizable monomer (A), a transparent resin (B), aphotopolymerization initiator (C), and a solvent (D), in which thephotopolymerizable monomer (A) is a bifunctional methacrylic monomer,and the content of a silane coupling agent is in the range of 1.0% bymass to 3.0% by mass in the total solid content; and a touch panelprotective film formed by curing the photosensitive resin composition.

SUMMARY OF THE INVENTION

An object to be solved by the invention is to provide a composition forforming a touch panel electrode protective film, the composition capableof providing a protective film having a low coefficient of staticfriction, excellent bending resistance, and excellent adhesiveness to atouch panel electrode; a transfer film; a transparent laminate; and amethod for forming a protective film for a touch panel electrode.

Furthermore, another object to be solved by the invention is to providea protective film for a touch panel electrode, which is produced usingthe composition for forming a touch panel electrode protective film, thetransfer film, and the method for forming a protective film for a touchpanel electrode; a capacitive input device; and an image display deviceincluding such a capacitive input device as a constituent element.

The objects of the invention described above have been addressed by themeans described in the following items <1>, <6> or <8> to <13>. Thesemeans will be described below together with items <2> to <5> and <7>,which are preferred embodiments.

<1> A composition for forming a touch panel electrode protective film,the composition comprising: a compound represented by Formula 1 asComponent A; a binder polymer as Component B; a photopolymerizationinitiator as Component C; and a monomer having a carboxy group asComponent D, in which the content of Component A is 5% by mass or moreand less than 50% by mass with respect to the total mass of monomercomponents,Q²-R¹-Q¹  (1)

in Formula 1, Q¹ and Q² each independently represent a (meth)acryloyloxygroup, and R¹ represents a divalent linking group having a chain-likestructure.

<2> The composition for forming a touch panel electrode protective filmdescribed in <1>, in which R¹ represents a divalent hydrocarbon grouphaving 2 to 12 carbon atoms which has a chain-like structure.

<3> The composition for forming a touch panel electrode protective filmdescribed in <1> or <2>, in which the content of Component A is 10% to40% by mass with respect to the total mass of the monomer components.

<4> The composition for forming a touch panel electrode protective filmdescribed in any one of <1> to <3>, in which Component D is a(meth)acrylate compound having a carboxy group.

<5> The composition for forming a touch panel electrode protective filmdescribed in any one of <1> to <4>, in which Component B is an acrylicresin having a carboxy group.

<6> A transfer film comprising: a temporary support; and aphotosensitive transparent resin layer formed from the composition forforming a touch panel electrode protective film described in any one of<1> to <5>.

<7> The transfer film described in <6>, further comprising a secondtransparent resin layer on the photosensitive transparent resin layer,in which the refractive index of the second transparent resin layer ishigher than the refractive index of the photosensitive transparent resinlayer.

<8> A transparent laminate comprising: a touch panel electrode; a secondtransparent resin layer disposed on the touch panel electrode; and aphotosensitive transparent resin layer disposed on the secondtransparent resin layer, in which the photosensitive transparent resinlayer is a layer obtained by curing the composition for forming a touchpanel electrode protective film described in any one of <1> to <5>, andthe refractive index of the second transparent resin layer is higherthan the refractive index of the photosensitive transparent resin layer.

<9> A method for forming a protective film for a touch panel electrode,the method comprising: providing a photosensitive transparent resinlayer formed from the composition for forming a touch panel electrodeprotective film described in any one of <1> to <5>, on a base materialhaving a touch panel electrode; exposing at least a portion of thephotosensitive transparent resin layer to actinic rays; and developingthe exposed photosensitive transparent resin layer, in this order.

<10> A method for forming a protective film for a touch panel electrode,the method comprising: providing a photosensitive transparent resinlayer on a base material having a touch panel electrode, using thetransfer film described in <6> or <7>; exposing at least a portion ofthe photosensitive transparent resin layer to actinic rays; anddeveloping the exposed photosensitive transparent resin layer, in thisorder.

<11> A protective film for a touch panel electrode, which is produced bythe method for forming a protective film for a touch panel electrodedescribed in <9> or <10>.

<12> A capacitive input device comprising the transparent laminatedescribed in <8> or the protective film for a touch panel electrodedescribed in <11>.

<13> An image display device comprising the capacitive input devicedescribed in <12> as a constituent element.

According to the invention, a composition for forming a touch panelelectrode protective film, the composition capable of providing aprotective film having a low coefficient of static friction, excellentbending resistance, and excellent adhesiveness to a touch panelelectrode; a transfer film; a transparent laminate; and a method forforming a protective film for a touch panel electrode can be provided.

Furthermore, according to the invention, a protective film for a touchpanel electrode, the protective film being produced using thecomposition for forming a touch panel electrode protective film, thetransfer film, and the method for forming a protective film for a touchpanel electrode; a capacitive input device; and an image display deviceincluding such a capacitive input device as a constituent element, canbe provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view illustrating an example ofthe configuration of a capacitive input device of the invention.

FIG. 2 is a schematic cross-sectional view illustrating another exampleof the configuration of the capacitive input device of the invention.

FIG. 3 is an explanatory diagram illustrating an example of atransparent laminate of the invention.

FIG. 4 is an explanatory diagram illustrating an example of therelationship between a transparent electrode pattern and a non-patternedregion according to the invention.

FIG. 5 is a top view illustrating an example of toughened glass havingan opening formed therein.

FIG. 6 is a top view illustrating an example of the transparent laminatehaving a mask layer formed thereon.

FIG. 7 is a top view illustrating an example of a transparent laminatehaving a first transparent electrode pattern formed thereon.

FIG. 8 is a top view illustrating an example of a transparent laminatehaving first and second transparent electrode patterns formed thereon.

FIG. 9 is a top view illustrating an example of a transparent laminatein which a conductive element other than first and second transparentelectrode patterns is formed.

FIG. 10 is a schematic cross-sectional view illustrating another exampleof the transparent laminate of the invention.

FIG. 11 is an explanatory diagram illustrating an example of a taperedshape of an edge of a transparent electrode pattern.

FIG. 12 is a schematic cross-sectional view illustrating an example ofthe configuration of the transparent laminate of the invention.

FIG. 13 is a schematic cross-sectional view illustrating an example ofthe configuration of the transfer film of the invention.

FIG. 14 is a top view illustrating another example of the configurationof the capacitive input device of the invention, and a schematic viewillustrating an embodiment including a terminal (end portion) of a leadwiring that is not covered by a photosensitive transparent resin layerafter patterning.

FIG. 15 is a schematic view illustrating an example of the transfer filmof the invention having a photosensitive transparent resin layer and asecond transparent resin layer, in a state of having been laminated on atransparent electrode pattern of a capacitive input device by alamination process but before being patterned.

FIG. 16 is a schematic view illustrating an example of a desired patternformed by a photosensitive transparent resin layer and a secondtransparent resin layer that have been cured.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The subject matters of the invention will be described in detail below.Explanation of the configuration requirements described below is basedon representative embodiments of the invention; however, the inventionis not intended to be limited to those embodiments. The expression “to”as used in the present specification is used to mean to include thenumerical values described before and after “to” as a lower limit and anupper limit, respectively. Also, an organic EL element according to theinvention refers to an organic electroluminescence element.

In regard to the description of a group (atomic group) according to thepresent specification, a description without the indication of beingsubstituted or unsubstituted is meant to include a group that does nothave a substituent as well as a group having a substituent. For example,the term “alkyl group” is to include an alkyl group having nosubstituent (unsubstituted alkyl group) as well as an alkyl group havinga substituent (substituted alkyl group).

According to the present specification, the term “(meth)acrylate”represents acrylate and methacrylate; the term “(meth)acryl” representsacryl and methacryl; and the term “(meth)acryloyl” represents acryloyland methacryloyl.

Furthermore, according to the invention, the units “% by mass” and “% byweight” have the same meaning, and the units “parts by mass” and “partsby weight” have the same meaning.

According to the invention, a combination of two or more preferredembodiments is a more preferred embodiment.

According to the invention, in regard to a polymer component, themolecular weight is a weight-average molecular weight that is measuredby gel permeation chromatography (GPC) in the case of usingtetrahydrofuran (THF) as a solvent, and calculated relative topolystyrene standards.

According to the invention, a “film thickness” means a “dried filmthickness”, unless particularly stated otherwise.

(Composition for Forming Touch Panel Electrode Protective Film)

The composition for forming a touch panel electrode protective film ofthe invention (hereinafter, may be simply referred to as “composition”)includes a compound represented by Formula 1 as Component A; a binderpolymer as Component B; a photopolymerization initiator as Component C;and a monomer having a carboxy group as Component D, in which thecontent of Component A is 5% by mass or more and less than 50% by masswith respect to the total mass of monomer components.Q²-R¹-Q¹  (1)

In Formula 1, Q¹ and Q² each independently represent a (meth)acryloyloxygroup, and R¹ represents a divalent linking group having a chain-likestructure.

In recent years, from the viewpoint of manufacturing using aroll-to-roll method and use for a curved surface portion, bendingresistance is required, but an improving effect is not sufficient in thecomposition in the related art.

The inventors of the invention conducted a thorough investigation inconsideration of such a viewpoint, and as a result, found that aprotective film having a low coefficient of static friction, excellentbending resistance, and excellent adhesiveness to a touch panelelectrode can be obtained by using a composition including a compoundrepresented by Formula 1 as Component A, a binder polymer as ComponentB, a photopolymerization initiator as Component C, and a monomer havinga carboxy group as Component D, in which the content of Component A is5% by mass or more and less than 50% by mass with respect to the totalmass of monomer components. Therefore, the invention is completed.

Although the expression mechanism of specific effects is not clear, itis assumed that a protective film having a low coefficient of staticfriction, excellent bending resistance, and excellent adhesiveness to atouch panel electrode can be obtained by an interaction between aspecific amount of a compound represented by Formula 1 and a monomerhaving a carboxy group.

The composition for forming a touch panel electrode protective film ofthe invention can be more suitably used as a composition for forming atransparent protective film.

Moreover, the composition for forming a touch panel electrode protectivefilm of the invention can be suitably used for a transfer film.Specifically, the composition for forming a touch panel electrodeprotective film of the invention can be suitably used as a transferlayer for forming a touch panel electrode protective film of thetransfer film.

Component A: Compound Represented by Formula 1

The composition for forming a touch panel electrode protective film ofthe invention includes a compound represented by Formula 1 as ComponentA, and the content of Component A is 5% by mass or more and less than50% by mass with respect to the total mass of monomer components.Q²-R¹-Q¹  (1)

In Formula 1, Q¹ and Q² each independently represent a (meth)acryloyloxygroup, and R¹ represents a divalent linking group having a chain-likestructure.

From the viewpoint of the ease of synthesis, it is preferable that Q¹and Q² represent the same groups. From the viewpoint of the reactivity,it is preferable that Q¹ and Q² each represent an acryloyloxy group.

The chain-like structure in R¹ may be a linear structure or a branchedstructure, and may have an aromatic ring or an alicyclic structure, andit is preferable that the chain-like structure does not have a condensedstructure or a crosslinked structure.

Examples of the divalent linking group having a chain-like structureinclude a linear or branched alkylene group, a group obtained by bondingone or more linear or branched alkylene groups to one or more arylenegroups, and a group obtained by bonding two or more linear or branchedalkylene groups to one or more ether bonds (for example, -(linear orbranched alkylene group)-{O-(linear or branched alkylene group)}_(p)-, prepresents an integer of 1 to 10).

From the viewpoint of resistance to moist heat of a cured film, le ispreferably a divalent hydrocarbon group having a chain-like structure,more preferably a divalent hydrocarbon group having 2 to 12 carbon atomsand a chain-like structure, even more preferably a linear or branchedalkylene group having 2 to 12 carbon atoms, and particularly preferablya linear alkylene group having 2 to 12 carbon atoms.

Specific examples of Component A include 1,3-butanedioldi(meth)acrylate, tetramethylene glycol di(meth)acrylate, neopentylglycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate,1,7-heptanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate,1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate,diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate,dipropylene glycol di(meth)acrylate, tripropylene glycoldi(meth)acrylate, polyethylene glycol di(meth)acrylate, andpolypropylene glycol di(meth)acrylate. The monomers can also be used asa mixture.

Among the compounds described above, 1,9-nonanediol di(meth)acrylate and1,10-decanediol di(meth)acrylate are preferably used.

Component A may be included singly, or two or more kinds thereof may beincluded.

The content of Component A is 5% by mass or more and less than 50% bymass, is preferably 10% to 40% by mass, and is more preferably 15% to35% by mass, with respect to the total mass of monomer components in thecomposition.

In a case where the content of Component A is in the above-describedrange, it is possible to obtain a protective film having a lowcoefficient of static friction and excellent bending resistance.

A monomer component refers to a compound having a (weight-average)molecular weight of less than 10,000 and having an ethylenicallyunsaturated group.

Furthermore, the content of Component A is preferably 1% to 30% by massand more preferably 5% to 20% by mass, with respect to the total solidcontent in the composition. The total solid content in the compositionrepresents the amount excluding volatile components such as a solvent.

Component B: Binder Polymer

The composition for forming a touch panel electrode protective film ofthe invention includes a binder polymer as Component B.

The binder polymer is not particularly limited as long as there is noeffect contradictory to the purport of the invention, and the binderpolymer can be appropriately selected from known compounds. Analkali-soluble resin is preferred.

As the alkali-soluble resin, the polymers described in paragraphs 0028to 0070 of JP2008-146018A, paragraph 0025 of JP2011-95716A, andparagraphs 0033 to 0052 of JP2010-237589A can be used.

Among them, as Component B, an acrylic resin having an acidic group ispreferred.

Examples of the acidic group include a carboxy group, a sulfonic acidgroup, a sulfonamide group, a phosphoric acid group, and a phenolichydroxyl group, and a carboxy group is preferred.

The acrylic resin is not particularly limited as long as the resin is apolymer of (meth)acrylic acid or a (meth)acrylate compound, and ispreferably a resin having 50% by mass or more of monomer units derivedfrom (meth)acrylic acid and a (meth)acrylate compound and morepreferably a copolymer of two or more monomer selected from the groupconsisting of (meth)acrylic acid and a (meth)acrylate compound.

Component B may be included singly, or two or more kinds thereof may beincluded.

The content of Component B is preferably 30% to 90% by mass and morepreferably 40% to 90% by mass, with respect to the total solid contentin the composition.

The weight-average molecular weight (Mw) of Component B is preferably10,000 or more, more preferably 10,000 to 200,000, even more preferably20,000 to 100,000, and particularly preferably 20,000 to 60,000.

Component C: Photopolymerization Initiator

The composition for forming a touch panel electrode protective film ofthe invention includes a photopolymerization initiator as Component C.

The photopolymerization initiator is preferably a photoradicalpolymerization initiator.

The photoradical polymerization initiator is not particularly limited,and any known agent can be used. Preferred examples thereof include anoxime ester compound, an α-aminoalkylphenon compound, and anα-hydroxyalkylphenone compound.

Regarding specific examples of the photoradical polymerizationinitiator, the photopolymerization initiators described in paragraphs0031 to 0042 of JP2011-95716A can be used. For example,1-(4-(phenylthio))-1,2-octanedione-2-(O-benzoyloxime) (trade name:IRGACURE OXE-01, manufactured by BASF SE), as well as1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone-1-(O-acetyloxime)(trade name: IRGACURE OXE-02, manufactured by BASF SE),2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone(trade name: IRGACURE 379EG, manufactured by BASF SE),2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one (trade name:IRGACURE 907, manufactured by BASF SE),2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionyl)benzyl]phenyl}-2-methylpropan-1-one(trade name: IRGACURE 127, manufactured by BASF SE),2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone (trade name:IRGACURE 369, manufactured by BASF SE),2-hydroxy-2-methyl-1-phenylpropan-1-one (trade name: IRGACURE 1173,manufactured by BASF SE), 1-hydroxycyclohexyl phenylketone (trade name:IRGACURE 184, manufactured by BASF SE),2,2-dimethoxy-1,2-diphenylethan-1-one (trade name: IRGACURE 651,manufactured by BASF SE), and an oxime ester-based photopolymerizationinitiator (trade name: IRGACURE OXE-03, manufactured by BASF SE), (tradename: Lunar 6, manufactured by DKSH Japan K.K.) can be preferably used.

Among them, Component C including an oxime ester compound is preferredand Component C including an oxime ester compound and anα-aminoalkylphenon compound is more preferred.

Component C may be included singly, or two or more kinds thereof may beincluded.

The content of Component C is preferably 0.1% to 10% by mass and morepreferably 0.2% to 5% by mass, with respect to the total solid contentin the composition.

Component D: Monomer Having Carboxy Group

The composition for forming a touch panel electrode protective film ofthe invention includes a monomer having a carboxy group as Component D.By incorporating Component D, a protective film having excellentadhesiveness to a touch panel electrode as well as a low coefficient ofstatic friction and excellent bending resistance can be obtained.

Component D is preferably an ethylenically unsaturated compound having acarboxy group and more preferably a (meth)acrylate compound having acarboxy group.

Furthermore, Component D is preferably a polyfunctional ethylenicallyunsaturated compound having a carboxy group, more preferably a tri- tododecafunctional ethylenically unsaturated compound having a carboxygroup, and even more preferably a tri- to octafunctional ethylenicallyunsaturated compound having a carboxy group.

The number of carboxy groups in Component D is preferably 1 to 6, morepreferably 1 to 3, and even more preferably 1.

Specific examples of Component D include (meth)acrylic acid,vinylbenzoic acid, maleic acid, maleic acid monoalkyl ester, fumaricacid, itaconic acid, crotonic acid, cinnamic acid, sorbic acid,α-cyanocinnamic acid, an acrylic acid dimer, a product obtained by anaddition reaction between a monomer having a hydroxyl group and cyclicacid anhydride, ω-carboxypolycaprolactone mono(meth)acrylate,2,2-tris(meth)acryloyloxy methylethyl succinate, succinic acid ester ofdipentaerythritol penta(meth)acrylate, phthalic acid ester ofdipentaerythritol penta(meth)acrylate, succinic acid ester ofpentaerythritol tri(meth)acrylate, phthalic acid ester ofpentaerythritol tri(meth)acrylate, and 2-(meth)acryloyloxy ethylsuccinate.

Among them, Component D is preferably 2,2-tris(meth)acryloyloxymethylethyl succinate, succinic acid ester of dipentaerythritolpenta(meth)acrylate, succinic acid ester of pentaerythritoltri(meth)acrylate, phthalic acid ester of pentaerythritoltri(meth)acrylate, or 2-(meth)acryloyloxy ethyl succinate, andparticularly preferably succinic acid ester of dipentaerythritolpenta(meth)acrylate, succinic acid ester of pentaerythritoltri(meth)acrylate, or phthalic acid ester of pentaerythritoltri(meth)acrylate.

Component D may be included singly, or two or more kinds thereof may beincluded.

The content of Component D is preferably 0.1% to 15% by mass, morepreferably 0.2% to 10% by mass, even more preferably 0.5% to 5% by mass,and particularly preferably 1% to 5% by mass, with respect to the totalsolid content in the composition. In a case where the content ofComponent D is in the above-described range, excellent adhesiveness isobtained.

The weight-average molecular weight of Component D is preferably lessthan 10,000, and the molecular weight of Component D is more preferablyless than 1,000.

Component E: Solvent

It is preferable that the composition for forming a touch panelelectrode protective film of the invention includes a solvent asComponent E.

Regarding the solvent, any general organic solvent can be used withoutany particular limitations, and examples thereof include methyl ethylketone, propylene glycol monomethyl ether, 1-methoxy-2-propylacetate(propylene glycol monomethyl ether acetate), cyclohexanone, methylisobutyl ketone, toluene, xylene, ethyl acetate, butyl acetate, ethyllactate, methyl lactate, and caprolactam.

Among them, preferred examples thereof include methyl ethyl ketoneand/or 1-methoxy-2-propylacetate.

Component E may be included singly or two or more kinds thereof may beincluded. It is preferable that two or more kinds thereof are included,and it is more preferable that methyl ethyl ketone and1-methoxy-2-propylacetate are included.

The content of Component E is preferably 10% to 95% by mass, morepreferably 20% to 90% by mass, and even more preferably 30% to 80% bymass, with respect to the total mass of the composition.

Component F: Other Monomers

It is preferable that the composition for forming a touch panelelectrode protective film of the invention includes other monomers asComponent F.

Preferred examples of Component F include ethylenically unsaturatedcompounds other than Component A and Component D, and more preferredexamples thereof include (meth)acrylate compounds other than Component Aand Component D.

Moreover, the weight-average molecular weight of Component F ispreferably less than 10,000.

It is preferable that at least a polyfunctional ethylenicallyunsaturated compound is included as Component F.

Preferred examples of Component F include urethane (meth)acrylate,polyester acrylate, and epoxy (meth)acrylate. In a case of thisembodiment, a protective film having a lower coefficient of staticfriction can be obtained.

Specifically, preferred examples thereof include the urethane(meth)acrylates described in JP1973-41708B (JP-548-41708B) JP1975-6034B(JP-550-6034B) and JP1976-37193A (JP-551-37193A); the polyester(meth)acrylates described in JP1973-64183A (JP-548-64183A),JP1974-43191B (JP-549-43191B), and JP1977-30490B (JP-552-30490B); andpolyfunctional (meth)acrylates such as epoxy (meth)acrylates which arereaction products between epoxy resins and (meth)acrylic acid. Urethane(meth)acrylate is particularly preferred.

The content of the urethane (meth)acrylate is preferably 0.1% to 20% bymass, more preferably 1% to 10% by mass, and even more preferably 2% to8% by mass, with respect to the total solid content in the composition.In a case where the content of the urethane (meth)acrylate is in theabove-described range, a protective film having a lower coefficient ofstatic friction is obtained.

Moreover, the weight-average molecular weight of each of urethane(meth)acrylate, polyester acrylate, and epoxy (meth)acrylate ispreferably 500 to 8,000, more preferably 700 to 5,000, and even morepreferably 1,000 to 2,000.

The composition for forming a touch panel electrode protective film ofthe invention preferably includes an ethylenically unsaturated compoundhaving a cyclic structure, more preferably includes a polyfunctionalethylenically unsaturated compound having a cyclic structure, and evenmore preferably includes a bifunctional ethylenically unsaturatedcompound having a cyclic structure, as Component F. In a case of thisembodiment, excellent bending resistance is obtained.

The ethylenically unsaturated compound having a cyclic structure ispreferably a (meth)acrylate compound having a cyclic structure.

Furthermore, the ethylenically unsaturated compound having a cyclicstructure is preferably an ethylenically unsaturated compound having analicyclic structure, and more preferably an ethylenically unsaturatedcompound having an aliphatic hydrocarbon ring structure.

Preferred examples of the ethylenically unsaturated compound having acyclic structure include cyclohexanediol di(meth)acrylate, cyclohexanedimethanol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate,di(meth)acrylate of hydrogenated bisphenol A, and di(meth)acrylate ofhydrogenated bisphenol F, more preferred examples thereof includecyclohexane dimethanol di(meth)acrylate and tricyclodecane dimethanoldi(meth)acrylate, and even more preferred examples thereof includetricyclodecane dimethanol di(meth)acrylate.

The content of the ethylenically unsaturated compound having a cyclicstructure is preferably 0.1% to 20% by mass, more preferably 1% to 10%by mass, and even more preferably 2% to 8% by mass, with respect to thetotal solid content in the composition. In a case where the content ofthe ethylenically unsaturated compound is in the above-described range,excellent bending resistance is obtained.

Component F may be included singly or two or more kinds thereof may beincluded. It is preferable that two or more kinds thereof are included.

It is particularly preferable that urethane (meth)acrylate and anethylenically unsaturated compound having a cyclic structure areincluded as Component F.

The content of Component F is preferably 0.1% to 40% by mass, morepreferably 1% to 30% by mass, and even more preferably 2% to 20% bymass, with respect to the total solid content in the composition.

<Other Additives>

The composition for forming a touch panel electrode protective film ofthe invention may also use other additives.

Examples of the other additives include the surfactants described inparagraph 0017 of JP4502784B and paragraphs 0060 to 0071 ofJP2009-237362A; the thermal polymerization inhibitors described inparagraph 0018 of JP4502784B; and other additives described inparagraphs 0058 to 0071 of JP2000-310706A.

The total content of the other additives is preferably 0.01% to 30% bymass, more preferably 0.1% to 20% by mass, and even more preferably 0.5%to 15% by mass, with respect to the total solid content in thecomposition.

The total content of Component A to Component D, and Component F in thecomposition for forming a touch panel electrode protective film of theinvention is preferably 80% by mass or more, more preferably 85% by massor more, and even more preferably 90% by mass or more, with respect tothe total solid content in the composition.

<Viscosity of Composition>

It is preferable that the viscosity of the composition for forming atouch panel electrode protective film of the invention as measured at100° C. is in the range of 2,000 to 50,000 Pa·sec.

Here, the viscosity of the composition can be measured as follows. Ameasurement sample is produced by removing the solvent from a coatingliquid for a transparent resin layer by drying under atmosphericpressure and reduced pressure. The viscosity is measured using, forexample, a VIBRON (Model DD-III; manufactured by Toyo Baldwin Co., Ltd.)as an analyzer, under the conditions of a measurement initiationtemperature of 50° C., a measurement completion temperature of 150° C.,a rate of temperature increase of 5° C./min, and a frequency ofvibration of 1 Hz/deg. The measurement value obtained at 100° C. can beused.

(Transfer Film)

The transfer film of the invention has a temporary support, and aphotosensitive transparent resin layer formed from the composition forforming a touch panel electrode protective film of the invention.

Furthermore, it is preferable that the transfer film of the inventionfurther has a temporary support and a second transparent resin layerhaving a refractive index that is higher than the refractive index ofthe photosensitive transparent resin layer, on the photosensitivetransparent resin layer. In this configuration, the photosensitivetransparent resin layer is positioned between the temporary support andthe second transparent resin layer. Furthermore, the transfer film ofthe invention may further have other layers.

By adopting such a configuration as described above, a transparentlaminate having an effect of reducing the visibility of the transparentelectrode pattern can be formed. Without being bound by any theory, whenthe difference between the refractive indices of the transparentelectrode pattern (preferably, Indium tin oxide (ITO)) and the secondtransparent resin layer is made small, light reflection is reduced, andthe transparent electrode pattern becomes not easily visible. Thus,visibility can be ameliorated.

In the following description, preferred embodiments of the transfer filmof the invention will be explained. The transfer film of the inventionis preferably intended for forming a touch panel electrode protectivefilm, and more preferably intended for forming a transparent insulatinglayer or a transparent protective layer of a capacitive input device.

<Temporary Support>

The transfer film of the invention has a temporary support.

Regarding the temporary support, a material which has flexibility anddoes not undergo significant deformation, shrinkage or elongation underpressure, or under pressure and heating, can be used. Examples of such asupport include a polyethylene terephthalate film, a cellulosetriacetate film, a polystyrene film, and a polycarbonate film. Amongthese, a biaxially stretched polyethylene terephthalate film isparticularly preferred.

The thickness of the temporary support is not particularly limited, andthe thickness is preferably in the range of 5 to 200 μm, and from theviewpoints of easy handleability and general-purpose usability, thethickness is particularly preferably in the range of 10 to 150 μm.

The temporary support may be transparent, and may contain a siliconoxide, an alumina sol, a chromium salt, a zirconium salt, or the like.

The temporary support can be imparted with electrical conductivity bythe method described in JP2005-221726A, or the like.

<Photosensitive Transparent Resin Layer>

The transfer film of the invention has a photosensitive transparentresin layer. The photosensitive transparent resin layer is a layerformed from the composition for forming a touch panel electrodeprotective film of the invention.

It is preferable that the photosensitive transparent resin layer isformed by applying the composition for forming a touch panel electrodeprotective film of the invention on a temporary support.

The film thickness of the photosensitive transparent resin layer usedfor the invention in a transfer film is preferably 1 μm or more, morepreferably 1 to 20 μm, even more preferably 1 to 15 μm, and particularlypreferably 3 to 12 μm. When the film thickness of the photosensitivetransparent resin layer is in the range described above, in a case inwhich a protective layer is produced using the resin film of theinvention, a protective layer having excellent protective properties isobtained, which is preferable.

<Second Transparent Resin Layer>

It is preferable that the transfer film of the invention has a secondtransparent resin layer. The second transparent resin layer is a layerhaving a refractive index that is higher than that of the photosensitivetransparent resin layer, and is preferably a layer formed from aphotocurable resin composition.

In a case where the second transparent resin layer has curingproperties, the refractive index of the second transparent resin layermeans a value of a refractive index measured on the transparent resinfilm after curing.

According to the present specification, the second transparent resinlayer is meant to include both a layer before being cured, and a layerafter being cured by light and/or heat.

The refractive index of the second transparent resin layer used for thetransfer film of the invention is preferably 1.55 or higher, and morepreferably 1.60 or higher. The upper limit is not particularly limited;however, the refractive index is preferably 2.30 or lower.

The film thickness of the second transparent resin layer used for thetransfer film of the invention is preferably 500 nm or less, and morepreferably 150 nm or less. Furthermore, the film thickness of the secondtransparent resin layer is preferably 55 nm or more, more preferably 60nm or more, and even more preferably 70 nm or more.

When the film thickness of the second transparent resin layer is in therange described above, in a case in which a protective layer is producedusing the resin film of the invention, a protective layer havingexcellent transparent electrode pattern concealability is obtained,which is preferable.

As long as the range of the refractive index such as described above issatisfied, the material for the second transparent resin layer is notparticularly limited.

It is preferable that the second transparent resin layer is formed byapplying a resin composition obtained by dissolving components such as abinder polymer, a polymerizable compound, and a polymerization initiatorin a solvent (hereinafter, also referred to as “second resincomposition”).

Furthermore, the second transparent resin layer may be a layerexhibiting water-insolubility; however, it is preferable that the secondtransparent resin layer is a layer exhibiting water-solubility.

According to the embodiment described above, after the photosensitivetransparent resin layer is laminated on the temporary support, even ifthe second transparent resin layer is laminated without curing thephotosensitive transparent resin layer, layer demarcation is achieved ata satisfactory level, and visibility of the transparent electrodepattern can be further ameliorated. Furthermore, after various layershave been transferred from the transfer film onto the transparentelectrode pattern, developing into a desired pattern can be achieved byphotolithography. If layer demarcation between the photosensitivetransparent resin layer and second transparent resin layers is poorlyachieved, the refractive index regulating effect is likely to becomeinsufficient, and amelioration of the visibility of the transparentelectrode pattern is likely to become insufficient.

A layer exhibiting water-solubility refers to a layer that completelydissolves and/or disperses, in a case in which the layer is immersed inwater at 25° C., in an immersion time of 10 minutes/μm or less per unitfilm thickness.

Furthermore, a layer exhibiting water-insolubility refers to a layerthat does not completely dissolve and/or disperse, in a case in whichthe layer is immersed in water at 25° C., in an immersion time of 10minutes/μm or less per unit film thickness.

According to the invention, in a case in which the transparent resinlayers have curing properties, the measurement by means of immersion inwater is carried out using the transparent resin layers before beingcured.

[Solvent]

In a case in which the second transparent resin layer is a layerexhibiting water-insolubility, the second resin composition can includegeneral organic solvents, and examples thereof include methyl ethylketone, propylene glycol monomethyl ether, propylene glycol monomethylether acetate, cyclohexanone, methyl isobutyl ketone, toluene, xylene,ethyl acetate, butyl acetate, ethyl lactate, methyl lactate, andcaprolactam.

In a case in which the second transparent resin layer is a layerexhibiting water-solubility, it is preferable that the second resincomposition uses water or a mixed solvent of water and a lower alcoholhaving 1 to 3 carbon atoms, as a water-based solvent. In regard to thetransfer film of the invention, it is preferable that the layerexhibiting water-solubility is formed by applying water or a mixedsolvent of water and a lower alcohol having 1 to 3 carbon atoms, and itis more preferable that the layer exhibiting water-solubility is formedby applying a coating liquid including water or a mixed solvent at acontent ratio of water/alcohol having 1 to 3 carbon atoms as a massratio of 20/80 to 100/0. The content ratio of water/alcohol having 1 to3 carbon atoms is particularly preferably in the range of 30/70 to 80/20as a mass ratio, and most preferably 35/65 to 65/35.

The water-based solvent is preferably water, a mixed solvent of waterand methanol, or a mixed solvent of water and ethanol, and from theviewpoints of drying and coatability, a mixed solvent of water andmethanol is more preferred.

[Metal Oxide Particles]

It is preferable that the second resin composition includes metal oxideparticles, for the purpose of regulating the refractive index or lighttransmittance. Since metal oxide particles are highly transparent andhave light transmittance, a resin composition having a high refractiveindex and excellent transparency is obtained.

It is preferable that the metal oxide particles have a higher refractiveindex than the refractive index of the resin composition includingmaterials excluding the metal oxide particles. Specifically, regardingthe metal oxide particles used for the second transparent resin layer,particles having a refractive index for light having a wavelength of 400to 750 nm of 1.70 or higher are more preferred; particles having arefractive index of 1.80 or higher are even more preferred; andparticles having a refractive index of 1.90 or higher are particularlypreferred.

Here, when it is said that the refractive index for light having awavelength of 400 to 750 nm is 1.50 or higher, it is implied that theaverage refractive index for light having a wavelength in theabove-mentioned range is 1.50 or higher, and it is not necessary thatthe refractive index for all light rays having wavelengths in theabove-mentioned range is 1.50 or higher. Furthermore, the averagerefractive index is a value obtained by dividing the sum total ofmeasured values of refractive index for various light rays havingwavelengths in the above-mentioned range, by the number of measurementpoints.

It should be noted that the metals for the metal oxide particles alsoinclude semi-metals such as B, Si, Ge, As, Sb and Te.

Regarding the metal oxide particles that are light-transmissible andhave a high refractive index, oxide particles containing atoms such asBe, Mg, Ca, Sr, Ba, Sc, Y, La, Ce, Gd, Tb, Dy, Yb, Lu, Ti, Zr, Hf, Nb,Mo, W, Zn, B, Al, Si, Ge, Sn, Pb, Sb, Bi, and Te are preferred; titaniumoxide, titanium composite oxide, zinc oxide, zirconium oxide, indium/tinoxide, and antimony/tin oxide are more preferred; titanium oxide,titanium composite oxide, and zirconium oxide are even more preferred;and titanium oxide, zirconium oxide, and tin oxide are particularlypreferred. From the viewpoint that the particles are chemically andphysically stable and that a fine particle dispersion liquid is readilyavailable, zirconium oxide is most preferred. These metal oxideparticles may also have the surface treated with an organic material,for the purpose of imparting dispersion stability to the particles.

From the viewpoint of transparency of the resin composition, the averageprimary particle size of the metal oxide particles is preferably 1 to200 nm, and particularly preferably 3 to 80 nm. Here, the averageprimary particle size of particles refers to a value obtained bymeasuring the particle sizes of any 200 arbitrary particles by electronmicroscopy, and calculating the arithmetic mean value thereof. In a casein which the shape of the particles is not spherical, the maximumdiameter among the external diameters of a particle is designated as theparticle size.

Regarding the metal oxide particles, one kind of particles may be usedalone, or two or more kinds of particles may be used in combination. Thecontent of the metal oxide particles in the resin composition describedabove may be appropriately determined in consideration of the refractiveindex, light transmittance and the like required for an optical memberobtainable from the resin composition. However, it is preferable toadjust the content of the metal oxide particles to 5% to 80% by mass,and more preferably to 10% to 70% by mass, with respect to the totalsolid content of the resin composition.

In regard to the transfer film of the invention, it is preferable thatthe second transparent resin layer has at least one of ZrO₂ particles orTiO₂ particles from the viewpoint of controlling the refractive index tothe range of the refractive index of the second transparent resin layer,and it is more preferable that the second transparent resin layer hasZrO₂ particles.

[Binder Polymer]

It is preferable that the second resin composition includes a binderpolymer. The binder polymer is not particularly limited as long as thereis no effect contradictory to the purport of the invention, and can beappropriately selected from among known binder polymers. Analkali-soluble resin is preferred, and regarding the alkali-solubleresin described above, the polymers described in paragraph 0025 ofJP2011-95716A and paragraphs 0033 to 0052 of JP2010-237589A can be used.Among them, an acrylic polymer having an acidic group is preferred.

Also, in a case in which the second transparent resin layer is a layerexhibiting water-solubility, a polymer having solubility in thewater-based solvent described above is used as the binder polymer.

The polymer having solubility in a water-based solvent is notparticularly limited as long as there is no effect contradictory to thepurport of the invention, and can be appropriately selected from amongknown polymers. Examples include the aforementioned acrylic polymerhaving an acidic group; the polyvinyl ether/maleic anhydride polymerdescribed in JP1971-2121A (JP-S46-2121A) and JP1981-40824B(JP-S56-40824B); water-soluble salts of carboxyalkyl celluloses,water-soluble cellulose ethers, water-soluble salts of carboxyalkylstarches; polyvinyl alcohol derivatives such as polyvinyl alcohol,water-soluble polyvinyl butyral, and water-soluble polyvinyl acetal;polyvinylpyrrolidone, various polyacrylamides, various water-solublepolyamides, water-soluble salts of polyacrylic acid, gelatin, anethylene oxide polymer, water-soluble salts of a family of variousstarches and analogues thereof, a styrene/maleic acid copolymer, and amaleate resin.

The polymer having solubility in a water-based solvent is preferably anacrylic polymer having an acidic group and a polyvinyl alcoholderivative, and particularly preferred examples include an acrylicpolymer having an acidic group, polyvinyl butyral, polyvinyl acetal,fully saponified polyvinyl alcohol, and a polyvinyl alcohol obtained bypartially saponifying polyvinyl acetate.

[Polymerizable Compound]

It is preferable that the resin compositions used for the photosensitivetransparent resin layer and the second transparent resin layer eachcontain a polymerizable compound.

The polymerizable compound is preferably a radical polymerizablecompound.

Examples of the polymerizable compound to be used for the photosensitivetransparent resin layer and the second transparent resin layer includemonofunctional acrylates or monofunctional methacrylates, such aspolyethylene glycol mono(meth)acrylate, polypropylene glycolmono(meth)acrylate, and phenoxyethyl (meth)acrylate; polyethylene glycoldi(meth)acrylate, polypropylene glycol di(meth)acrylate,trimethylolethane triacrylate, trimethylolpropane triacrylate,trimethylolpropane diacrylate, neopentyl glycol di(meth)acrylate,pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate,dipentaerythritol hexa(meth)acrylate, dipentaerythritolpenta(meth)acrylate, hexanediol di(meth)acrylate, trimethylolpropanetri(acryloyloxypropyl) ether, tri(acryloyloxyethyl) isocyanurate,tri(acryloyloxyethyl) cyanurate, and glycerin tri(meth)acrylate; andpolyfunctional acrylates or polyfunctional methacrylates, such asproducts obtained by adding ethylene oxide or propylene oxide topolyfunctional alcohols such as trimethylolpropane or glycerin, and then(meth)acrylating the adducts.

Further examples include the urethane acrylates described inJP1973-41708B (JP-S48-41708B), JP1975-6034B (JP-S50-6034B), andJP1976-37193A (JP-S51-37193A); the polyester acrylates described inJP1973-64183A (JP-S48-64183A), JP1974-43191B (JP-S49-43191B), andJP1977-30490B (JP-S52-30490B); and polyfunctional acrylates ormethacrylates, such as epoxy acrylates which are reaction productsbetween epoxy resins and (meth)acrylic acid. Furthermore, acrylamidemonomers can also be suitably used. Among the polymerizable compoundsdescribed above, polyfunctional acrylates, urethane acrylates, andacrylamide monomers are preferred.

Regarding the polymerizable compound to be used in a case in which thephotosensitive transparent resin layer and/or the second transparentresin layer is a layer exhibiting water-solubility, examples alsoinclude a monomer having a hydroxyl group, and a monomer having ethyleneoxide or polypropylene oxide and a phosphoric acid group in themolecule, in addition to the polymerizable compounds described above.

[Polymerization Initiator]

It is preferable that the resin composition to be used for the secondtransparent resin layer includes a polymerization initiator.

The polymerization initiator to be used for the second transparent resinlayer is preferably a photopolymerization initiator, and a photoradicalpolymerization initiator is preferred.

In a case in which the second transparent resin layer is a water-solublelayer, it is preferable to use a photopolymerization initiator havingsolubility in a water-based solvent, and preferred examples includeIRGACURE 2959 (manufactured by BASF SE) and a polymerization initiatorrepresented by the following Formula 2.

On the other hand, regarding the photopolymerization initiator orpolymerization initiator system to be used in the case of a layerexhibiting water-insolubility, the photopolymerization initiatorsdescribed in paragraphs 0031 to 0042 of JP2011-95716A can be used.Examples that can be preferably used include1-4-(phenylthio)-1,2-octanedione-2-(O-benzoyloxime) (trade name:IRGACURE OXE-01, manufactured by BASF SE), as well as1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone-1-(O-acetyloxime)(trade name: IRGACURE OXE-02, manufactured by BASF SE),2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone(trade name: IRGACURE 379EG, manufactured by BASF SE),2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one (trade name:IRGACURE 907, manufactured by BASF SE),2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)benzyl]phenyl}-2-methylpropan-1-one(trade name: IRGACURE 127, manufactured by BASF SE),2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 (trade name:IRGACURE 369, manufactured by BASF SE),2-hydroxy-2-methyl-1-phenylpropan-1-one (trade name: IRGACURE 1173,manufactured by BASF SE), 1-hydroxycyclohexyl phenylketone (trade name:IRGACURE 184, manufactured by BASF SE),2,2-dimethoxy-1,2-diphenylethan-1-one (trade name: IRGACURE 651,manufactured by BASF SE), and an oxime ester-based photopolymerizationinitiator or polymerization initiator (trade name: Lunar 6, manufacturedby DKSH Japan K.K.).

[Polymer Latex]

Furthermore, in a case in which the resin composition for the secondtransparent resin layer includes a water-based solvent, the resincomposition to be used for the second transparent resin layer mayinclude polymer latex. Here, the polymer latex as used herein is aproduct in which fine particles of a water-insoluble polymer aredispersed in water. In regard to the polymer latex, details aredescribed in, for example, Muroi Soichi, “Kobunshi Latekkusu no Kagaku(Chemistry of Polymer Latexes) (published by Kobunshi Kankokai (1973))”.

Regarding the polymer particles that can be used, polymer particlesformed from acrylic, vinyl acetate-based, rubber-based (for example,styrene-butadiene-based and chloroprene-based), olefin-based,polyester-based, polyurethane-based, and polystyrene-based polymers, andcopolymers of these polymers, are preferred. It is preferable tostrengthen the mutual bonding force between the polymer chains thatconstitute the polymer particles. Regarding the means for strengtheningthe mutual bonding force between polymer chains, a method of utilizingan interaction based on hydrogen bonding, and a method of producingcovalent bonds may be used. Regarding the means for imparting hydrogenbonding force, it is preferable to introduce a monomer having a polargroup into a polymer chain by performing copolymerization or graftpolymerization. Examples of the polar group include a carboxyl group(contained in acrylic acid, methacrylic acid, itaconic acid, fumaricacid, maleic acid, crotonic acid, partially esterified maleic acid, andthe like), primary, secondary and tertiary amino groups, an ammoniumsalt group, and a sulfonic acid group (styrenesulfonic acid). A carboxylgroup and a sulfonic acid group are particularly preferred. A preferredrange for the copolymerization ratio of such a monomer having a polargroup is 5% to 35% by mass, more preferably 5% to 20% by mass, and evenmore preferably in the range of 15% to 20% by mass, with respect to 100%by mass of the polymer. On the other hand, regarding the means forproducing covalent bonds, a method of reacting a hydroxyl group, acarboxyl group, a primary amino group, a secondary amino group, anacetoacetyl group, sulfonic acid or the like, with an epoxy compound, ablocked isocyanate, an isocyanate, a vinylsulfone compound, an aldehydecompound, a methylol compound, a carboxylic acid anhydride or the like,may be used.

Among the polymers obtained by utilizing these reactions, a polyurethanederivative obtainable by a reaction between a polyol and apolyisocyanate compound is preferred, and it is more preferable to use apolyvalent amine as a chain extending agent in combination with thepolymer. It is particularly preferable to introduce the polar groupsdescribed above into the polymer chain to obtain an ionomer typepolymer.

The weight-average molecular weight of the polymer is preferably 10,000or more, and more preferably 20,000 to 100,000. As a polymer suitablefor the invention, an ethylene ionomer which is a copolymer betweenethylene and methacrylic acid, and a polyurethane ionomer may bementioned.

The polymer latex that can be used for the invention may be a productobtainable by emulsion polymerization, or may be a product obtainable byemulsification. The methods for producing these polymer latexes aredescribed in, for example, “Emarujon⋅Ratekkusu Handobukku (Handbook ofEmulsions and Latexes)” (edited by Editorial Committee for Handbook ofEmulsions and Latexes, published by Taiseisha, Ltd. (1975)).

Examples of the polymer latex that can be used for the invention includean aqueous dispersion of a polyethylene ionomer (trade name: CHEMIPEARLS120, manufactured by Mitsui Chemicals, Inc., solid content 27%), (tradename; CHEMIPEARL S100, manufactured by Mitsui Chemicals, Inc., solidcontent 27%), (trade name: CHEMIPEARL S111, manufactured by MitsuiChemicals, Inc., solid content 27%), (trade name: CHEMIPEARL S200,manufactured by Mitsui Chemicals, Inc., solid content 27%), (trade name:CHEMIPEARL 5300, manufactured by Mitsui Chemicals, Inc., solid content35%), (trade name: CHEMIPEARL 5650, manufactured by Mitsui Chemicals,Inc., solid content 27%), or (trade name: CHEMIPEARL S75N, manufacturedby Mitsui Chemicals, Inc., solid content 24%); an aqueous dispersion ofa polyether-based polyurethane (trade name: HYDRAN WLS-201, manufacturedby DIC Corporation, solid content 35%, Tg: −50° C.), (trade name: HYDRANWLS-202, manufactured by DIC Corporation, solid content 35%, Tg: −50°C.), (trade name: WLS-221, manufactured by DIC Corporation, solidcontent 35%, Tg: −30° C.), (trade name: HYDRAN WLS-210, manufactured byDIC Corporation, solid content 35%, Tg: −15° C.), (trade name: HYDRANWLS-213, manufactured by DIC Corporation, solid content 35%, Tg: −15°C.), (trade name: HYDRAN WLI-602, manufactured by DIC Corporation, solidcontent 39.5%, Tg: −50° C.), or (trade name: HYDRAN WLI-611,manufactured by DIC Corporation, solid content 39.5%, Tg: −15° C.); andproducts obtained by subjecting an acrylic acid alkyl copolymer ammonium(trade name: JURYMER AT-210, manufactured by Nihon Junyaku Co., Ltd.),an acrylic acid alkyl copolymer ammonium (trade name: JURYMER ET-410,manufactured by Nihon Junyaku Co., Ltd.), an acrylic acid alkylcopolymer ammonium (trade name: JURYMER AT-510, manufactured by NihonJunyaku Co., Ltd.), and polyacrylic acid (trade name: JURYMER AC-10L,manufactured by Nihon Junyaku Co., Ltd.), to neutralization with ammoniaand emulsification.

[Other Additives]

In the second transparent resin layer, additives may also be used.Examples of the additives described above include the surfactantsdescribed in paragraph 0017 of JP4502784B and paragraphs 0060 to 0071 ofJP2009-237362A; the thermal polymerization inhibitors described inparagraph 0018 of JP4502784B; and the other additives described inparagraphs 0058 to 0071 of JP2000-310706A.

<Protective Film>

It is preferable that the transfer film of the invention has aprotective film adjacently on the photosensitive transparent resinlayer.

The protective films described in paragraphs 0083 to 0087 and 0093 ofJP2006-259138A can be used as appropriate.

The protective film can be formed by pressure-bonding a sheet formedfrom the material described above, onto a film on which thephotosensitive transparent resin layer and the like have been formed.

Regarding the pressure-bonding method, any known method can be usedwithout any particular limitations.

<Other Layers>

The transfer film of the invention may also have other layers accordingto the purpose. Examples of the other layers include a thermoplasticresin layer that is provided between the temporary support and thephotosensitive transparent resin layer; an interlayer that is providedbetween the photosensitive transparent resin layer and the thermoplasticresin layer; a hard coat layer that is provided between thephotosensitive transparent resin layer and the temporary support inorder to impart physical durability to the surface of the photosensitivetransparent resin layer after transfer; and a release layer that isprovided between the temporary support and the photosensitivetransparent resin layer in order to facilitate peeling of the temporarysupport at the time of transfer.

[Thermoplastic Resin Layer]

It is preferable that the transfer film of the invention has athermoplastic resin layer between the temporary support and thephotosensitive transparent resin layer. When a transparent laminate isformed by transferring a photosensitive transparent resin layer and asecond curable transparent resin layer using a transfer film having thethermoplastic resin layer, air bubbles are not easily generated in thevarious elements formed by being transferred, image unevenness is notlikely to be produced in the image display device, and excellent displaycharacteristics can be obtained.

It is preferable that the thermoplastic resin layer is alkali-soluble.The thermoplastic resin layer plays the role as a cushion material so asto absorb the unevenness of the ground surface (also including thesurface unevenness caused by images that have already been formed, orthe like), and has a property of changing the shape in conformity withthe surface unevenness of the object surface.

In regard to the thermoplastic resin layer, an embodiment including theorganic polymer materials described in JP1993-72724A (JP-H05-72724A) ascomponents is preferred, and an embodiment including at least oneselected from organic polymer materials having a softening point ofabout 80° C. or lower as measured by the Vicat method [specifically, thepolymer softening point measuring method according to ASTM D1235 of theAmerican Materials Testing Methods] is particularly preferred.

Specific examples thereof include organic polymers, such as polyolefinssuch as polyethylene and polypropylene; an ethylene copolymer ofethylene and vinyl acetate or a saponification product thereof, acopolymer of ethylene and an acrylic acid ester or a saponificationproduct thereof, polyvinyl chloride or a vinyl chloride copolymer ofvinyl chloride and vinyl acetate or a saponification product thereof;polyvinylidene chloride, a vinylidene chloride copolymer; polystyrene, astyrene copolymer of styrene and a (meth)acrylic acid ester or asaponification product thereof; polyvinyltoluene, a vinyltoluenecopolymer of vinyltoluene and a (meth)acrylic acid ester or asaponification product thereof; poly(meth)acrylic acid ester, a(meth)acrylic acid ester copolymer of butyl (meth)acrylate and vinylacetate or the like; a vinyl acetate copolymer; and polyamide resinssuch as nylon, copolymerized nylon, N-alkoxymethylated nylon, andN-dimethylaminated nylon.

The layer thickness of the thermoplastic resin layer is preferably 3 to30 μm. In a case in which the layer thickness of the thermoplastic resinlayer is less than 3 μm, the shape conformity at the time of laminatingis insufficient, and the thermoplastic resin layer may not perfectlyabsorb the unevenness of the ground surface. Furthermore, in a case inwhich the layer thickness is more than 30 μm, drying (solvent removal)may be performed under load at the time of forming the thermoplasticresin layer on the temporary support, or time may be required fordeveloping of the thermoplastic resin layer, which deteriorates theprocess suitability. The layer thickness of the thermoplastic resinlayer is more preferably 4 to 25 μm, and particularly preferably 5 to 20μm.

The thermoplastic resin layer can be formed by applying a liquidpreparation containing a thermoplastic organic polymer or the like, andthe liquid preparation used at the time of application or the like canbe produced using a solvent. The solvent is not particularly limited aslong as the solvent can dissolve the polymer component that constitutesthe above-described layer, and examples thereof include methyl ethylketone, cyclohexanone, propylene glycol monomethyl ether acetate,n-propanol, and 2-propanol.

—Viscosity of Composition Used for Forming Thermoplastic Resin Layer—

It is preferable that the viscosity of the composition used for formingthe thermoplastic resin layer as measured at 100° C. is in the range of1,000 to 10,000 Pa·sec, and it is more preferable that the viscosity ofthe composition for forming a touch panel electrode protective film ofthe invention as measured at 100° C. is in the range of 2,000 to 50,000Pa·sec, and the following Expression A is satisfied.Viscosity of composition used for forming thermoplastic resinlayer<viscosity of composition used for forming photosensitivetransparent resin layer  Expression A:

[Interlayer]

It is preferable that the transfer film of the invention furtherincludes an interlayer between the photosensitive transparent resinlayer and the thermoplastic resin layer, from the viewpoint ofpreventing mixing of components when a plurality of layers are formed byapplication and are stored after application. Regarding the interlayeris preferably an oxygen barrier film having an oxygen barrier function,which is described as a “separating layer” in JP1993-72724A(JP-H05-72724A), and sensitivity at the time of exposure increases, thetime burden of exposure machine can be reduced, and productivity isincreased.

Regarding the interlayer, those described in paragraphs 0083 to 0087 and0093 of JP2006-259138A can be appropriately used.

FIG. 13 illustrates an example of a preferable configuration of thetransfer film of the invention. FIG. 13 is a schematic view of thetransfer film 30 of the invention, in which a temporary support 26, aphotosensitive transparent resin layer 7, a second transparent resinlayer 12, and a protective release layer (protective film) 29 arelaminated adjacently to each other in this order.

(Method for Producing Transfer Film)

The transfer film of the invention can be produced according to themethod for producing a photosensitive transfer material described inparagraphs 0094 to 0098 of JP2006-259138A. Above all, it is preferablethat the transfer film of the invention is produced according to thefollowing method for producing a transfer film of the invention.

The method for producing a transfer film of the invention is notparticularly limited; however, it is preferable that the method includesa step of forming a photosensitive transparent resin layer on atemporary support, as Step A; and it is more preferable that the methodfurther includes a step of forming a second transparent resin layer onthe photosensitive transparent resin layer, as Step B, after Step A.

Preferred embodiments of the temporary support, the photosensitivetransparent resin layer, and the second transparent resin layeraccording to the method for producing the transfer film of the inventionare similar to the preferred embodiments of these elements for thetransfer film of the invention described above.

<Step of Forming Photosensitive Transparent Resin Layer on TemporarySupport>

The method for producing a transfer film of the invention includes, asStep A, a step of forming a photosensitive transparent resin layer on atemporary support.

In regard to the method for forming a photosensitive transparent resinlayer, it is preferable that the photosensitive transparent resin layeris formed by applying the composition for forming a touch panelelectrode protective film of the transfer film of the invention, whichincludes a polymerizable compound, a photopolymerization initiator, anda coating solvent, on a temporary support.

Regarding the method for applying the composition for forming a touchpanel electrode protective film, any known method can be used withoutparticular limitations; however, for example, a method of forming thephotosensitive transparent resin layer by performing application anddrying using a coating machine such as a spinner, a whirler, a rollcoater, a curtain coater, a knife coater, a wire bar coater, or anextruder, can be preferably mentioned.

<Step of Forming Second Transparent Resin Layer on PhotosensitiveTransparent Resin Layer>

It is preferable that the method for producing a transfer film of theinvention further includes, as Step B, a step of forming a secondtransparent resin layer on the photosensitive transparent resin layerthat has been produced on the temporary support.

Regarding the method for forming a second transparent resin layer, it ispreferable that the second transparent resin layer is formed by applyinga second resin composition which includes a metal oxide and has arefractive index after drying of 1.60, on the photosensitive transparentresin layer.

Regarding the method for applying the resin composition, any knownmethod can be used without particular limitations, and a method offorming the second transparent resin layer by performing application anddrying using a coating machine such as a spinner, a whirler, a rollcoater, a curtain coater, a knife coater, a wire bar coater, or anextruder, may be preferably used.

In a case in which the method includes Step B, a second transparentresin layer is formed on the photosensitive transparent resin layerformed by Step A as described above.

In regard to the method for producing a transfer film of the invention,it is preferable that the resin composition for any one between thephotosensitive transparent resin layer and the second transparent resinlayer is such that the content of water and an alcohol having 1 to 3carbon atoms in the coating solvent is 70% by mass or more in total, andthe other resin compositions are such that the content of water and analcohol having 1 to 3 carbon atoms in the coating solvent is 20% by massor less in total. It is more preferable that the content of water and analcohol having 1 to 3 carbon atoms in the coating solvent of thecomposition for forming a touch panel electrode protective film is 70%by mass or more in total, and the content of water and an alcohol having1 to 3 carbon atoms in the coating solvent of the second resincomposition is 20% by mass or less in total.

As a result of such a configuration, after the photosensitivetransparent resin layer is laminated, even if the second transparentresin layer is laminated without curing the photosensitive transparentresin layer, layer demarcation is achieved at a satisfactory level, andthe refractive indices of the two layers are maintained. Thus,visibility of the transparent electrode pattern may be ameliorated(becoming not easily visible) as intended. In this case, since thetransfer film is produced while having the photosensitive transparentresin layer and the second transparent resin layer in an uncured state,a desired pattern can be produced by photolithography after variouslayers have been transferred onto the transparent electrode pattern.

On the contrary, in a case in which the second transparent resin layeris laminated on the photosensitive transparent resin layer withoutinvolving the configuration such as described above, since the twolayers are mixed, and an intended refractive index is not maintained,the effect of ameliorating visibility of the transparent electrodepattern is not obtained. In this case, in a case in which thephotosensitive transparent resin layer has been cured before the secondtransparent resin layer is laminated, layer demarcation of the twolayers is easily achieved; however, in a transfer film produced as such,the photosensitive transparent resin layer has already been cured,patterning by photolithography cannot be performed.

It is preferable that the method for producing a transfer film of theinvention includes a step of further forming a thermoplastic resin layerbefore the photosensitive transparent resin layer is formed on thetemporary support.

It is preferable that the method for forming a transfer film of theinvention includes, after the step of forming the thermoplastic resinlayer, a step of forming an interlayer between the thermoplastic resinlayer and the photosensitive transparent resin layer.

In a case in which a transfer film having an interlayer is formed, thetransfer film can be suitably produced by applying a solution preparedby dissolving a thermoplastic organic polymer together with additives(coating liquid for a thermoplastic resin layer) on a temporary support,drying the solution to provide a thermoplastic resin layer, and thenlaminating an interlayer by applying a liquid preparation prepared byadding a resin or additives to a solvent that does not dissolve thethermoplastic resin layer (coating liquid for an interlayer) on thisthermoplastic resin layer, and drying the liquid preparation.

(Transparent Laminate)

The transparent laminate of the invention has a touch panel electrode(hereinafter, also referred to as “transparent electrode pattern”); asecond transparent resin layer disposed on the touch panel electrode;and a photosensitive transparent resin layer disposed on the secondtransparent resin layer, in which the photosensitive transparent resinlayer is a layer obtained by curing the composition for forming a touchpanel electrode protective film of the invention, and the refractiveindex of the second transparent resin layer is higher than therefractive index of the photosensitive transparent resin layer.

According to the embodiment described above, visibility of thetransparent electrode pattern can be reduced.

Preferred embodiments of the second transparent resin layer and thephotosensitive transparent resin layer for the transparent laminate ofthe invention are similar to the preferred embodiments of these elementsfor the transfer film of the invention described above.

The transparent laminate of the invention may further have a transparentfilm having a refractive index of 1.60 to 1.78 and a film thickness of55 to 110 nm (hereinafter, also simply referred to as “transparentfilm”) or a known hard coat layer, on the transparent electrode patternon the side opposite to the side where the second transparent resinlayer has been formed. It is preferable that the transparent laminatefurther has a transparent film having a refractive index of 1.60 to 1.78and a film thickness of 55 to 110 nm, from the viewpoint of furtherameliorating visibility of the transparent electrode pattern. Accordingto the present specification, unless particularly stated otherwise, in acase in which the term “transparent film” is described, it refers to “atransparent film having a refractive index of 1.60 to 1.78 and a filmthickness of 55 to 110 nm”.

It is preferable that the transparent laminate of the invention furtherhas a transparent substrate on the transparent film having a refractiveindex of 1.60 to 1.78 and a film thickness of 55 to 110 nm, on the sideopposite to the side where the transparent electrode pattern has beenformed. The transparent substrate is preferably a transparent filmsubstrate. In this case, it is preferable that the transparent film isdisposed between the transparent electrode pattern and the transparentfilm substrate.

Furthermore, in regard to the transparent laminate of the invention, itis preferable that the transparent electrode pattern is a transparentelectrode pattern formed on a transparent film substrate.

FIG. 10 illustrates an exemplary embodiment of the transparent laminateof the invention.

In FIG. 10, the transparent laminate has a transparent substrate 1 and atransparent film 11 having a refractive index of 1.60 to 1.78 and a filmthickness of 55 to 110 nm, and a transparent electrode pattern 4, a padpart 3 a that will be described below, a metal wiring section 9, asecond transparent resin layer 12, and a photosensitive transparentresin layer 7 are laminated in this order.

Furthermore, in a partial region 14 on the metal wiring section, thesecond transparent resin layer 12 and the photosensitive transparentresin layer 7 have been removed by patterning.

FIG. 12 illustrates an exemplary configuration of the transparentlaminate of the invention.

In FIG. 12, the transparent laminate has a transparent substrate 1 and atransparent film 11 having a refractive index of 1.60 to 1.78 and a filmthickness of 55 to 110 nm, and has a region 21 in plane, in which atransparent electrode pattern 4, a second transparent resin layer 12 anda photosensitive transparent resin layer 7 are laminated in this order.

The term “in plane” means a direction that is approximately parallel tothe plane that is parallel to the transparent substrate of thetransparent laminate. When it is said that a region in which atransparent electrode pattern 4, a second transparent resin layer 12 anda photosensitive transparent resin layer 7 are laminated in this orderis included in plane, it is implied that orthographic projection for aregion in which the transparent electrode pattern 4, the secondtransparent resin layer 12 and the photosensitive transparent resinlayer 7 are laminated in this order, onto a plane that is parallel tothe transparent substrate of the transparent laminate, exists in theplane that is parallel to the transparent substrate of the transparentlaminate.

Here, in a case in which the transparent laminate of the invention isused for a capacitive input device that will be described below, thetransparent electrode pattern may be provided as a first transparentelectrode pattern and a second transparent electrode patternrespectively in two directions that are approximately orthogonal,namely, a transverse direction and a longitudinal direction (forexample, see FIG. 4). For example, in the configuration of FIG. 4, thetransparent electrode pattern of the transparent laminate of theinvention may be a second transparent electrode pattern 4, or may be apad part 3 a of the first transparent electrode pattern 3. In otherwords, in the following explanation for the transparent laminate of theinvention, the reference numeral for the transparent electrode patternmay be representatively indicated by “4”; however, the transparentelectrode pattern in the transparent laminate of the invention is notintended to be limited to the use as the second transparent electrodepattern 4 in the capacitive input device of the invention, and may alsobe used as, for example, a pad part 3 a of the first transparentelectrode pattern 3.

It is preferable that the transparent laminate of the invention includesa non-patterned region in which the transparent electrode pattern is notformed. In the present specification, a non-patterned region means aregion in which the transparent electrode pattern 4 is not formed.

FIG. 12 illustrates an embodiment in which the transparent laminate ofthe invention includes the non-patterned region 22.

In regard to the transparent laminate of the invention, it is preferablethat a region in which the transparent substrate, the transparent film,and the photosensitive transparent resin layer are laminated in thisorder, is included in plane in at least a portion of the non-patternedregion 22 in which the transparent electrode pattern is not formed.

In regard to the transparent laminate of the invention, it is preferablethat in the region in which the transparent substrate, the transparentfilm, and the photosensitive transparent resin layer are laminated inthis order, the transparent film and the photosensitive transparentresin layer are adjacent to each other.

However, in regions other than the non-patterned region 22, as long asthere is no effect contradictory to the purport of the invention, othermembers may be disposed at any arbitrary positions. For example, in acase in which the transparent laminate of the invention is used in acapacitive input device that will be described below, a mask layer 2, aninsulating layer 5, a metal wiring section 6 and the like can belaminated thereon.

In regard to the transparent laminate of the invention, it is preferablethat the transparent substrate and the transparent film are adjacent toeach other.

FIG. 12 illustrates an embodiment in which the transparent film 11 islaminated on the transparent substrate 1 adjacently thereto.

However, as long as there is no effect contradictory to the purport ofthe invention, a third transparent film may be laminated between thetransparent substrate and the transparent film. For example, it ispreferable that a third transparent film having a refractive index of1.5 to 1.52 (not shown in FIG. 12) is included between the transparentsubstrate and the transparent film.

In regard to the transparent laminate of the invention, it is preferablethat the transparent film and the transparent electrode pattern areadjacent to each other.

FIG. 12 illustrates an embodiment in which the transparent electrodepattern 4 is adjacently laminated on a partial region of the transparentfilm 11.

As illustrated in FIG. 12, the shape of the edge of the transparentelectrode pattern 4 is not particularly limited; however, the edge mayhave a tapered shape, and for example, the edge may have a tapered shapein which the plane on the transparent substrate side is larger than theplane on the side opposite to the transparent substrate.

Here, when the edge of the transparent electrode pattern has a taperedshape, the angle of the edge of the transparent electrode pattern(hereinafter, also referred to as taper angle) is preferably 30° orless, more preferably 0.1° to 15°, and particularly preferably 0.5° to5°.

In regard to the method for measuring the taper angle according to thepresent specification, the taper angle can be determined by taking amicroscopic photograph of an edge of the transparent electrode pattern,approximating the taper part in the microscopic photograph to atriangle, and directly measuring the taper angle.

FIG. 11 illustrates an example of the case in which an edge of thetransparent electrode pattern has a tapered shape. The triangleapproximating the taper part in FIG. 11 has an underside of 800 nm and aheight (film thickness at the upper base part that is approximatelyparallel to the underside) of 40 nm, and the taper angle α at this timeis about 3°. The underside of the triangle approximating the taper partis preferably 10 to 3,000 nm, more preferably 100 to 1,500 nm, andparticularly preferably 300 to 1,000 nm. A preferred range of the heightof the triangle approximating the taper part is similar to the preferredrange of the film thickness of the transparent electrode pattern.

It is preferable that the transparent laminate of the invention includesa region in plane, in which the transparent electrode pattern and thephotosensitive transparent resin layer are adjacent to each other.

FIG. 12 illustrates an embodiment in which, in the region 21 in whichthe transparent electrode pattern, the second transparent resin layerand the photosensitive transparent resin layer are laminated in thisorder, the transparent electrode pattern, the photosensitive transparentresin layer, and the second transparent resin layer are adjacent to eachother.

In regard to the transparent laminate of the invention, it is preferablethat, in the region where the transparent electrode pattern is to beformed, both the transparent electrode pattern and the non-patternedregion 22 in which the transparent electrode pattern is not formed arecontinuously covered, directly or with another layer interposedtherebetween, by the transparent film and the photosensitive transparentresin layer.

Here, the term “continuously” means that the transparent film and thephotosensitive transparent resin layer are not patterned films but arecontinuous films. That is, it is preferable that the transparent filmand the photosensitive transparent resin layer do not have openings onthe region where the transparent electrode pattern is formed, from theviewpoint of making the transparent electrode pattern not easilyvisually recognizable.

Furthermore, it is preferable that the transparent electrode pattern andthe non-patterned region 22 are directly covered by the transparent filmand the photosensitive transparent resin layer, rather than beingcovered with another layer interposed therebetween. The “other layer” inthe case in which the transparent electrode pattern and thenon-patterned region are covered with another layer interposedtherebetween, may be an insulating layer 5 that is included in thecapacitive input device of the invention that will be described below,and in a case in which two or more layers of transparent electrodepatterns are included as in the case of the capacitive input device ofthe invention that will be described below, the “other layer” may be thesecond layer transparent electrode pattern.

FIG. 12 illustrates an embodiment in which the second transparent resinlayer 12 is laminated over the region in which the transparent electrodepattern 4 is not laminated on the transparent film 11 and over thetransparent electrode pattern 4, the second transparent resin layer 12being adjacent to both of the two, respectively.

Furthermore, in a case in which the edge of the transparent electrodepattern 4 has a tapered shape, it is preferable that the secondtransparent resin layer 12 is laminated along the tapered shape (at thesame gradient as the taper angle).

FIG. 12 illustrates an embodiment in which the photosensitivetransparent resin layer 7 is laminated on the surface of the secondtransparent resin layer 12 on the side opposite to the surface on whichthe transparent electrode pattern has been formed.

<Transparent Electrode Pattern>

The transparent laminate of the invention includes a transparentelectrode pattern.

It is preferable that the transparent electrode pattern is a transparentelectrode pattern that is disposed on a transparent substrate that willbe described below, and it is more preferable that the transparentelectrode pattern is a transparent electrode pattern formed on atransparent film substrate.

The refractive index of the transparent electrode pattern is preferably1.75 to 2.1.

The material for the transparent electrode pattern is not particularlylimited, and any known material can be used. For example, thetransparent electrode pattern can be produced from a light-transmissiveconductive metal oxide film such as indium tin oxide (ITO) or indiumzinc oxide (IZO). A transparent conductive film containing oxide of Zn(IZO) or these as a main component is attracting more attentiondepending on the applications, since the transparent conductive film hasa higher etching rate than an ITO film does. Examples of such aconductive film include an ITO film; metal films of Al, Zn, Cu, Fe, Ni,Cr, and Mo; and metal oxide films of SiO₂.

The film thickness of the transparent electrode pattern is preferably 10to 200 nm. Furthermore, in order to convert an amorphous ITO film into apolycrystalline ITO film through calcination, the electrical resistancemay be reduced.

In addition to that, in a case in which a first conductive pattern orthe like is formed using ITO or the like, reference may be made toparagraphs 0014 to 0016 of JP4506785B and the like. Above all, thetransparent electrode pattern is preferably an ITO film or an IZO film,and particularly preferably an ITO film.

It is preferable that the transparent electrode pattern for thetransparent laminate of the invention is an ITO film having a refractiveindex of 1.75 to 2.1.

<Metal Wiring Section Electrically Connected to Transparent ElectrodePattern>

It is preferable that the transparent laminate of the invention includesa metal wiring section in a form of being electrically connected to thetransparent electrode pattern.

Regarding the metal wiring section, for example, copper, gold, silver,aluminum, or alloys containing the aforementioned metals are used. Inconsideration of the balance between electrical conductivity and cost, awiring using copper or an alloy containing copper is preferred.

The method for forming conduction between the metal wiring section andthe transparent electrode pattern is not particularly limited, and it isacceptable as long as the two are electrically connected.

It is preferable that the photosensitive transparent resin layer and/orthe second transparent resin layer are patterned, and it is morepreferable that the photosensitive transparent resin layer and thesecond transparent resin layer are both patterned. It is even morepreferable that the photosensitive transparent resin layer and thesecond transparent resin layer in the above-described region on themetal wiring section are both patterned.

When it is said that a layer is patterned, it means that a portion ofthe layer is intentionally removed, and thereby, a region in which thelayer exists in the in-plane direction and a region in which the layerdoes not exist are formed. Regarding the patterning method, a methodbased on exposure and developing that will be described below may bepreferably used.

According to the embodiment described above, connection between themetal wiring section and another flexible wiring is facilitated. Anexample of the transparent laminate of the embodiment is the embodimentillustrated in FIG. 10.

According to the invention, when the protective film has superiorresistance to moist heat and perspiration resistance, corrosion of themetal wiring section can be suppressed.

<Transparent Substrate>

It is preferable that the transparent laminate of the invention includesa transparent substrate.

The transparent substrate may be a transparent glass substrate, or maybe a transparent film substrate; however, the transparent substrate ispreferably a transparent film substrate having a refractive index of1.50 to 1.55. Furthermore, the refractive index of the transparentsubstrate is preferably 1.50 to 1.52, and a transparent film substratehaving a refractive index of 1.50 to 1.52 is preferred.

In a case in which the transparent substrate is a transparent glasssubstrate (also referred to as light-transmissive substrate of glass),toughened glass represented by GORILLA GLASS of Corning, Inc. or thelike can be used. Regarding the transparent substrate, the materialsused in JP2010-86684A, JP2010-152809A and JP2010-257492A can bepreferably used, the disclosures of which are incorporated herein.

In a case in which the transparent substrate is a transparent filmsubstrate, the transparent film substrate is preferably a transparentresin film. Examples of the resin material that forms the transparentresin film include a poly(meth)acrylic resin, a cellulose triacetate(TAC)-based resin, a polyethylene terephthalate (PET)-based resin, apolycarbonate-based resin, and a cycloolefin-based resin. Among these,from the viewpoint of general-purpose usability, a cellulose triacetate(TAC)-based resin, a polyethylene terephthalate (PET)-based resin, and acycloolefin-based resin are preferred. The thickness of the transparentresin film is preferably in the range of 2 to 200 μm, and morepreferably in the range of 2 to 100 μm. When the thickness is 2 μm ormore, sufficient mechanical strength of the film substrate is obtained,and handling operation of the roll is made easy. On the other hand, whenthe thickness is 200 μm or less, bending characteristics are enhanced,and handling operation of the roll is made easy.

<Transparent Film>

It is preferable that the transparent laminate of the invention furtherhas a transparent film for reducing interfacial reflection between thetransparent electrode pattern and the transparent film substrate. Therefractive index of the transparent film is preferably 1.60 to 1.78, andmore preferably 1.65 to 1.74. Furthermore, the film thickness of thetransparent film is preferably 55 to 110 nm, more preferably 60 to 110nm, and even more preferably 70 to 110 nm.

Here, the transparent film may have a single-layer structure, or mayhave a laminated structure of two or more layers. In a case in which thetransparent film has a laminated structure of two or more layers, therefractive index of the transparent film means the refractive index ofthe layers as a whole, and the film thickness of the transparent filmmeans the total film thickness of the layers as a whole. As long as sucha range of refractive index is satisfied, the material for thetransparent film is not particularly limited.

A preferred range of the material for the transparent film and preferredranges of the physical properties such as refractive index are similarto the preferred ranges of the material and the properties of thephotosensitive transparent resin layer.

The transparent laminate of the invention is preferably such that thetransparent film is a transparent resin film. There are no particularlimitations on the metal oxide particles, binder polymer, and otheradditives that are used for the transparent resin film as long as thereis no effect contradictory to the purport of the invention, and theresins or other additives that are used for the photosensitivetransparent resin for the transfer film of the invention can bepreferably used.

Regarding the transparent laminate of the invention, the transparentfilm may also be an inorganic film.

Regarding the inorganic film, the inorganic films used in JP2010-86684A,JP2010-152809A, JP2010-257492A and the like can be used, and it ispreferable to use an inorganic film having a laminated structure of alow refractive index material and a high refractive index material asdescribed in these patent literatures, or an inorganic film of a mixedfilm of a low refractive index material and a high refractive indexmaterial, from the viewpoint of controlling the refractive index.Regarding the low refractive index material and the high refractiveindex material, the materials used in JP2010-86684A, JP2010-152809A andJP2010-257492A can be preferably used, the disclosures of which areincorporated herein.

The inorganic film may be a mixed film of SiO₂ and Nb₂O₅, and in thatcase, it is more preferable that the inorganic film is a mixed film ofSiO₂ and Nb₂O₅ formed by sputtering.

<Additional Transparent Film>

The transparent laminate of the invention may further include anadditional transparent film.

It is preferable that the additional transparent film is includedbetween a transparent substrate and a transparent film.

The refractive index of the additional transparent film should be closeto the refractive index of the transparent substrate. From the viewpointof ameliorating visibility of the transparent electrode pattern, therefractive index is preferably 1.50 to 1.55, and more preferably 1.50 to1.52.

<Hard Coat Layer>

Between the transparent substrate and the transparent electrode pattern,a hard coat layer may be introduced instead of the above-mentionedtransparent film having a refractive index of 1.60 to 1.78 and a filmthickness of 55 to 110 nm. The hard coat layer may be formed by a dryprocess such as a vacuum vapor deposition method, a sputtering method oran ion plating method; or by a wet method (coating method). Regardingthe wet method (coating method), a coating method using a roll coater, areverse roll coater, a gravure coater, a microgravure coater, a knifecoater, a bar coater, a wire bar coater, a die coater, or a dip coatercan be used.

The hard coat layer is introduced from the viewpoint of easy slidingproperties or from the viewpoint of enhancing hardness, and is formedby, for example, a cured product obtained by curing a reactive siliconcompound such as tetraethoxysilane, or a curable composition having apolyfunctional (meth)acrylate or the like by means of heat, ultravioletradiation (UV) or ionizing radiation. Inorganic fine particles such ascolloidal silica may also be added thereto, and the refractive index ofthe hard coat layer is adjusted to be about 1.45 to 1.55.

<Formation of Transparent Electrode Pattern on Both Surfaces ofTransparent Substrate>

The transparent electrode pattern may be formed only on one surface ofthe transparent substrate, or may be formed on both surfaces. In a casein which the electrode pattern is formed on both surfaces of thetransparent substrate, the hard coat layer and the optical adjustmentlayer formed between the transparent substrate and the transparentelectrode pattern may be formed symmetrically on both surfaces, or maybe formed asymmetrically, in terms of thickness or layer configuration.In a case in which the transparent electrode pattern is formed on bothsurfaces, it is preferable that the photosensitive transparent resinlayer and the second transparent resin layer included in the transferfilm of the invention are transferred to both surfaces.

That is, it is preferable that the laminate of the invention has thetransparent electrode pattern, the photosensitive transparent resinlayer and the second transparent resin layer on each of the two surfacesof a transparent film substrate. An example of the configuration of thetransparent laminate in this case is the embodiment illustrated in FIG.1 that will be described below.

(Method for Forming Protective Film for Touch Panel Electrode)

One embodiment of the method for forming a protective film for a touchpanel electrode of the invention includes an arrangement step ofproviding a photosensitive transparent resin layer formed from thecomposition for forming a touch panel electrode protective film of theinvention, on a base material having a touch panel electrode; anexposure step of exposing at least a portion of the photosensitivetransparent resin layer to actinic rays; and a developing step ofdeveloping the exposed photosensitive transparent resin layer, in thisorder.

Furthermore, another embodiment of the method for forming a protectivefilm for a touch panel electrode includes an arrangement step ofproviding a photosensitive transparent resin layer on a base materialhaving a touch panel electrode, using the transfer film of theinvention; an exposure step of exposing at least a portion of thephotosensitive transparent resin layer to actinic rays; and a developingstep of developing the exposed photosensitive transparent resin layer,in this order.

In a case in which the transparent laminate of the invention further hasa second transparent resin layer, the photosensitive transparent resinlayer and the second transparent resin layer can be transferred at thesame time, and a transparent laminate that is free from the problem thatthe transparent electrode pattern is visually recognized can be producedeasily with high productivity.

Furthermore, the touch panel electrode is preferably a transparentelectrode pattern formed on a transparent film substrate.

<Arrangement Step>

It is preferable that the method for forming a protective film for atouch panel electrode of the invention includes an arrangement step ofproviding a photosensitive transparent resin layer formed from thecomposition for forming a touch panel electrode protective film of theinvention.

In regard to the arrangement step, it is preferable that thephotosensitive transparent resin layer is formed by applying thecomposition for forming a touch panel electrode protective film of theinvention on a touch panel electrode.

Regarding the method for applying the composition for forming a touchpanel electrode protective film of the invention, any known method canbe used without any particular limitations, and for example, a method offorming a film by applying the composition using a coating machine suchas a spinner, a whirler, a roll coater, a curtain coater, a knifecoater, a wire bar coater or an extruder, and drying the composition,may be preferably used.

Furthermore, in regard to the arrangement step, it is preferable that asecond transparent resin layer is further formed by applying a secondresin composition on a touch panel electrode.

The second resin composition has the same meaning as the second resincomposition explained in connection with the transfer film, and thepreferred range thereof is also similar.

Regarding the method of applying the second resin composition, any knownmethod can be used without any particular limitations, and for example,a method of forming a layer by applying the composition using a coatingmachine such as a spinner, a whirler, a roll coater, a curtain coater, aknife coater, a wire bar coater or an extruder, and drying thecomposition, may be preferably used.

In the case of forming a second transparent resin layer, thephotosensitive transparent resin layer is applied on the secondtransparent resin layer.

In regard to the arrangement step, it is also preferable to provide aphotosensitive transparent resin layer using the transfer film of theinvention.

The arrangement step of providing a photosensitive transparent resinlayer using the transfer film of the invention is a step of laminating(bonding) the photosensitive transparent resin layer of the transferfilm of the invention on a transparent electrode pattern. At this time,in a case in which the transfer film has the above-mentioned protectivefilm, it is preferable to have the protective film removed beforelamination.

It is also preferable that the transfer film includes a secondtransparent resin layer.

Lamination of the photosensitive transparent resin layer (and secondtransparent resin layer) onto the surface of a transparent electrodepattern is carried out by superposing the photosensitive transparentresin layer (and second transparent resin layer) on the surface of atransparent electrode pattern, and pressing and heating the assembly.For the bonding process, a known laminator such as a laminator, a vacuumlaminator, or an autocut laminator, which can further increaseproductivity, can be used.

<Peeling Step of Peeling Temporary Support>

In a case in which a photosensitive transparent resin layer is providedusing the transfer film of the invention in the arrangement step, it ispreferable that the method for forming a protective film for a touchpanel electrode of the invention further includes a peeling step ofpeeling the temporary support after the arrangement step.

The method for peeling the temporary support is not particularlylimited, and any known method can be used. Furthermore, the peeling stepmay be carried out prior to the exposure step that will be describedbelow, or may be carried out between the exposure step and thedeveloping step.

<Step of Surface-Treating Transparent Substrate>

Furthermore, the method for producing a transparent laminate of theinvention may include a step of surface-treating the transparentsubstrate, by which the non-contact surface of the substrate(transparent film substrate or front face plate) is subjected to asurface treatment, before the arrangement step, in order to increase theadhesiveness of the various layers formed during the arrangement step.Regarding the surface treatment, it is preferable to perform a surfacetreatment using a silane compound (silane coupling treatment). It ispreferable that the silane coupling agent has a functional group capableof interacting with a photosensitive resin. For example, a silanecoupling liquid (0.3 mass % aqueous solution ofN-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, trade name: KBM603,manufactured by Shin-Etsu Chemical Co., Ltd.) is sprayed by showeringfor 20 seconds, and the surface is washed by showering pure water.Subsequently, the laminate is allowed to react by heating. A heatingbath may be used, and the reaction can also be accelerated bypreliminary heating of the substrate of the laminator.

A preferred embodiment of the transparent substrate is similar to thepreferred embodiment of the transparent substrate for the transparentlaminate of the invention.

<Step of Forming Transparent Electrode Pattern>

The method for manufacturing a transparent laminate of the invention mayalso include a step of forming a transparent electrode pattern.

The transparent electrode pattern can be formed on a transparentsubstrate, or on the transparent film having a refractive index of 1.60to 1.78 and a film thickness of 55 to 110 nm, using the methods forforming a first transparent electrode pattern 3, a second transparentelectrode pattern 4 and a metal wiring section 6 described in theexplanation for the capacitive input device of the invention that willfollow. A method of using a photosensitive film is preferred. It ispreferable that the step of forming a transparent electrode pattern iscarried out prior to the arrangement step.

<Exposure Step>

It is preferable that the method for forming a protective film for atouch panel electrode of the invention further includes an exposure stepof exposing at least a portion of the photosensitive transparent resinlayer to actinic rays.

Regarding an example of the exposure step, the method described inparagraphs 0035 to 0051 of JP2006-23696A can also be suitably used inthe invention.

If necessary, it is also acceptable to perform the exposure step and thedeveloping step on layers other than the photosensitive transparentresin layer.

The exposure step is a step of exposing the photosensitive transparentresin layer arranged on the transparent electrode pattern.

In regard to the arrangement step, in a case in which a secondtransparent resin layer is formed, it is preferable that the exposurestep is a step of exposing the photosensitive transparent resin layerand the second transparent resin layer.

Specifically, a method of disposing a predetermined mask above thephotosensitive transparent resin layer and/or the second transparentresin layer that have been formed on the transparent electrode pattern,and subsequently exposing the photosensitive transparent resin layerand/or the second transparent resin layer from above the mask throughthe mask; or a method of exposing the entire surface of thephotosensitive transparent resin layer and/or the second transparentresin layer without using a mask, may be used.

Here, regarding the light source for exposure, any light source that canemit light having a wavelength range capable of curing thephotosensitive transparent resin layer and/or the second transparentresin layer (for example, 365 nm or 405 nm) can be appropriatelyselected and used. Specific examples include an ultrahigh pressuremercury lamp, a high pressure mercury lamp, and a metal halide lamp. Theamount of exposure is preferably 5 to 200 mJ/cm² and more preferably 10to 100 mJ/cm².

<Developing Step>

It is preferable that the method for forming a protective film for atouch panel electrode of the invention further includes a developingstep of developing the exposed photosensitive transparent resin layer.

In regard to the arrangement step, in a case in which the secondtransparent resin layer is formed, it is preferable that the developingstep is a step of developing the exposed photosensitive transparentresin layer and/or the second transparent resin layer.

The developing step is not intended to mean a developing step in anarrow sense, by which the photosensitive transparent resin layer andthe second transparent resin layer that have been exposed patternwiseare developed patternwise using a developer, but is meant to alsoinclude the case in which only the thermoplastic resin layer or theinterlayer is removed after exposure of the entire surface, and thephotosensitive transparent resin layer and the second transparent resinlayer themselves do not have any pattern formed therein.

The developing process can be carried out using a developer.

The developer is not particularly limited, and any known developer, suchas the developers described in JP1993-72724A (JP-H05-72724A), can beused.

The developer is preferably a developer which exhibits a developingbehavior of a type in which the photosensitive transparent resin layeris dissolved, and for example, a developer including a compound having apKa of 7 to 13 at a concentration of 0.05 to 5 mol/L is preferred.

On the other hand, the developer used in a case in which thephotosensitive transparent resin layer and the second transparent resinlayer themselves do not form patterns, is preferably a developer whichexhibits developing behavior of a type in which a non-alkali-developablecolored composition layer is not dissolved, and for example, a developerincluding a compound having a pKa of 7 to 13 at a concentration of 0.05to 5 mol/L is preferred. The developer may also include a small amountof an organic solvent that is miscible with water. Examples of theorganic solvent that is miscible with water include methanol, ethanol,2-propanol, 1-propanol, butanol, diacetone alcohol, ethylene glycolmonomethyl ether, ethylene glycol monoethyl ether, ethylene glycolmono-n-butyl ether, benzyl alcohol, acetone, methyl ethyl ketone,cyclohexanone, ε-caprolactone, γ-butyrolactone, dimethylformamide,dimethylacetamide, hexamethyl phosphoramide, ethyl lactate, methyllactate, ε-caprolactam, and N-methylpyrrolidone.

The concentration of the organic solvent is preferably 0.1% to 30% bymass.

Also, known surfactants can be further added to the developer.

The concentration of the surfactants is preferably 0.01% to 10% by mass.

Regarding the method for developing, any of methods such as puddledeveloping, shower developing, shower and spinning developing, dipdeveloping and the like may be used. Here, to explain the showerdeveloping method, an uncured part can be removed by spraying adeveloper by showering to the photosensitive transparent resin layer andthe second transparent resin layer after exposure. Furthermore, in acase in which a thermoplastic resin layer or an interlayer is providedon a photosensitive film having a photosensitive transparent resin layerthat is used for etching of the transparent electrode pattern, it ispreferable to have the thermoplastic resin layer, the interlayer and thelike removed in advance before developing, by spraying an alkalineliquid having low solubility for the photosensitive transparent resinlayer, by showering or the like. Furthermore, it is preferable to removea developing residue after developing, by spraying a detergent or thelike by showering and scrubbing with a brush or the like. The liquidtemperature of the developer is preferably 20° C. to 40° C., and the pHof the developer is preferably 8 to 13.

Furthermore, the exposure step may be carried out after peeling thetemporary support, or exposure may be performed before the temporarysupport is peeled off, and then the temporary support may be peeled off.The exposure may be exposure through a mask, or may be digital exposureusing a laser or the like.

<Other Steps>

The method for producing a transparent laminate described above may alsoinclude other steps such as a post-exposure step and a post-bake step.In a case in which the photosensitive transparent resin layer (and thesecond transparent resin layer) is a transparent resin layer(s) havingthermosetting properties, it is preferable to carry out a post-bake stepafter the developing step.

<Step of Forming Transparent Film>

It is preferable that the method for producing a transparent laminate ofthe invention includes a step of forming a transparent film.

In regard to the step of forming a transparent film, in a case in whichthe transparent laminate has a transparent film having a refractiveindex of 1.60 to 1.78 and a film thickness of 55 to 110 nm on thetransparent electrode pattern on the side opposite to the side where thesecond transparent resin layer is formed, the transparent film is formeddirectly on the transparent electrode pattern, or with another layersuch as the above-described additional transparent film interposedbetween the transparent film and the transparent electrode pattern.

The method for forming the transparent film is not particularly limited;however, it is preferable to form the transparent film by transfer orsputtering.

Above all, the step of forming a transparent film is preferably a stepof forming a transparent film by transferring a transparent curableresin film formed on a temporary support onto the transparent substrateand forming a film; and more preferably a step of forming a transparentfilm by curing the transparent curable resin film after transfer, andforming a film. Regarding the method for transfer and curing, there maybe mentioned a method of performing transfer, exposure, developing andother steps similarly to the method of transferring the photosensitivetransparent resin layer and the second transparent resin layer inconnection to the method for producing a transparent laminate of theinvention using a photosensitive film, in the explanation for thecapacitive input device of the invention that will be described below.In that case, it is preferable to adjust the refractive index of thetransparent film to the range described above, by dispersing the metaloxide fine particles in the photocurable resin layer in thephotosensitive film.

On the other hand, in a case in which the transparent film is aninorganic film, it is preferable that the transparent film is formed bysputtering. That is, in regard to the transparent laminate of theinvention, it is also preferable that the transparent film is formed bysputtering.

Regarding the sputtering method, the methods used in JP2010-86684A,JP2010-152809A, and JP2010-257492A can be preferably used, thedisclosures of which are incorporated herein.

<Step of Forming Additional Transparent Film>

It is preferable that the method for producing a transparent laminate ofthe invention includes a step of forming an additional transparent film.

The step of forming an additional transparent film is a step similar tothe step of forming a transparent film.

(Protective Film for Touch Panel Electrode)

The protective film for a touch panel electrode of the invention isproduced by the method for forming a protective film for a touch panelelectrode of the invention.

(Capacitive Input Device)

The capacitive input device of the invention includes the transparentlaminate of the invention, or the protective film for a touch panelelectrode of the invention.

It is preferable that the capacitive input device of the invention has aphotosensitive transparent resin layer (and the second transparent resinlayer) in which at least a portion has been exposed and developed. Sincethe capacitive input device of the invention needs to be connected toanother wiring member (flexible print substrate or the like) at aterminal of a lead wiring, it is preferable that the terminal of thelead wiring is not covered by the photosensitive transparent resin layer(and the second transparent resin layer).

The above-described embodiment is illustrated in FIG. 14. FIG. 14illustrates a capacitive input device having the followingconfiguration, which includes a lead wiring (metal wiring section 6) ofthe transparent electrode pattern and a terminal 31 of the lead wiring.

The photosensitive transparent resin layer (and the second transparentresin layer) on the terminal 31 of the lead wiring has been removedthrough the patterning step (exposure step and developing step), and theterminal 31 of the lead wiring is exposed.

Specific embodiments of exposure and developing are illustrated in FIG.15 and FIG. 16. FIG. 15 illustrates a state in which the transfer film30 of the invention having a photosensitive transparent resin layer anda second transparent resin layer has been laminated on a transparentelectrode pattern of a capacitive input device by lamination, and astate before the laminated material is cured by exposure to light or thelike. In the case of utilizing photolithography, that is, in the case ofperforming curing by exposure to light, the cured area (exposed portion)33 of the photosensitive transparent resin layer and the secondtransparent resin layer having the shape illustrated in FIG. 16 can beobtained by performing patternwise exposure using a mask and developingof unexposed portions. Specifically, in FIG. 16, there are obtained anopening 34 that is an uncured area of the photosensitive transparentresin layer and the second transparent resin layer and corresponds tothe terminal of the lead wiring; and cured areas (desired patterns) ofthe photosensitive transparent resin layer and the second transparentresin layer, which are intended not to cover the terminal (wiringlead-out portion) of the lead wiring, from which edges of the transferfilm of the invention having the photosensitive transparent resin layerand the second transparent resin layer protruding outward from thecontour of the frame part of the capacitive input device, have beeneliminated.

As a result, another wiring member can be directly connected to theterminal 31 of the lead wiring, and thereby, signals of a sensor can betransmitted to an electrical circuit.

In the following description, the details of a preferred embodiment ofthe capacitive input device of the invention will be explained.

It is preferable that the capacitive input device of the invention has atransparent substrate (corresponding to the transparent substrate of thetransparent laminate of the invention), and at least the followingelements of (3) and (6) to (8) on one side or on both sides of thetransparent substrate, and also has the transparent laminate of theinvention:

(3) a plurality of first transparent electrode patterns formed by aplurality of pad parts extending in a first direction through connectionparts;

(6) a metal wiring section in a form of being electrically connected tothe first transparent electrode patterns;

(7) a second transparent resin layer formed so as to cover the entiretyor a portion of the elements (3) and (6); and

(8) a photosensitive transparent resin layer formed so as to cover theelement (7).

Here, the (8) photosensitive transparent resin layer corresponds to thephotosensitive transparent resin layer in the transparent laminate ofthe invention. It is preferable that the (8) photosensitive transparentresin layer is formed on the (6) metal wiring section, and it ispreferable that a portion or the entirety of the photosensitivetransparent resin layer in a region on the metal wiring section has beenremoved by patterning.

Furthermore, the (7) second transparent resin layer corresponds to thesecond transparent resin layer in the transparent laminate of theinvention. Meanwhile, it is preferable that the photosensitivetransparent resin layer is a so-called transparent protective layer forcapacitive input devices that are conventionally known.

The capacitive input device of the invention may have the followingelements (4) and (5) between the (3) first transparent electrodepatterns and/or the (6) metal wiring section and the (8) photosensitivetransparent resin layer. Particularly, in a case in which the elementsof (3) and (6) to (8) exist only on one side of the transparentsubstrate, it is preferable that the capacitive input device has thefollowing elements (4) and (5):

(4) a plurality of second electrode patterns that are electricallyinsulated from the first transparent electrode patterns, and consist ofa plurality of pad parts formed by extending in a directionperpendicularly intersecting the first direction; and

(5) an insulating layer that electrically insulates the firsttransparent electrode patterns and the second electrode patterns.

The capacitive input device of the invention is preferably such that the(4) second electrode patterns are transparent electrode patterns.

Between the (3) first transparent electrode patterns and the (4) secondelectrode patterns, transparent ones correspond to the transparentelectrode pattern in the transparent laminate of the invention. In acase in which both of them are transparent, both of them correspond tothe transparent electrode pattern in the transparent laminate of theinvention.

It is preferable that the capacitive input device of the inventionfurther has the (2) transparent film disposed between the (3) firsttransparent electrode patterns and the transparent substrate; betweenthe (4) second electrode patterns and the transparent substrate; orbetween the (6) metal wiring section and the transparent substrate.Here, it is preferable that the (2) transparent film corresponds to thetransparent film having a refractive index of 1.60 to 1.78 and a filmthickness of 55 to 110 nm in the transparent laminate of the invention,from the viewpoint of further ameliorating visibility of the transparentelectrode patterns.

The capacitive input device of the invention may further have (1) a masklayer and/or a decorative layer, if necessary. The mask layer isprovided as a black frame around the region that is touched by a finger,a touch pen or the like, in order to make the lead wiring of thetransparent electrode pattern invisible from the contact side, or toprovide decoration. The decorative layer is provided for the purpose ofdecoration, and for example, a white decorative layer is provided.

In a case in which the (1) mask layer and/or decorative layer exists, itis preferable that the capacitive input device has the (1) mask layerand/or decorative layer disposed between the (2) transparent film andthe transparent substrate, between the (3) first transparent electrodepatterns and the transparent substrate; between the (4) second electrodepatterns and the transparent substrate; or between the (6) metal wiringsection and the transparent substrate. It is more preferable that the(1) mask layer and/or decorative layer is provided adjacently to thetransparent substrate.

In a case in which the transparent substrate is a transparent filmsubstrate, it is preferable that the (1) mask layer and/or decorativelayer is further integrated with a cover glass that is disposed on thevisible side of the transparent substrate. In the case of such anembodiment, it is preferable that the transparent laminate of theinvention does not have the (1) mask layer and/or decorative layer, fromthe viewpoint that in a case in which the second transparent resin layerand the photosensitive transparent resin layer are transferred from thetransfer film of the invention, a level difference that may causeincorporation of air bubbles can be reduced.

In regard to the capacitive input device of the invention, even in acase in which the capacitive input device includes such various members,the transparent electrode pattern can be made invisible by including thesecond transparent resin layer that is disposed on the transparentelectrode pattern, and the photosensitive transparent resin layer thatis disposed on the second transparent resin layer. Thus, the problem ofvisibility of the transparent electrode pattern can be ameliorated.Furthermore, as described above, by adopting a configuration in whichthe transparent film having a refractive index of 1.60 to 1.78 and afilm thickness of 55 to 110 nm and the second transparent resin layerdescribed above are used, and a transparent electrode pattern isinterposed therebetween, the problem of visibility of the transparentelectrode pattern can be further ameliorated.

<Configuration of Capacitive Input Device>

First, a preferred configuration of the capacitive input device of theinvention will be explained together with the method for producing thevarious members that constitute the device. FIG. 1 is a cross-sectionalview illustrating an exemplary preferred configuration of thetransparent laminate or capacitive input device of the invention, theconfiguration of the capacitive input device having a transparentelectrode pattern provided as a single layer on both sides of thetransparent substrate. FIG. 1 illustrates an embodiment in which thecapacitive input device 10 is configured to include a transparentsubstrate (transparent film substrate) 1, and symmetrically provided onboth surfaces of the transparent substrate 1, a transparent film 11having a refractive index of 1.60 to 1.78 and a film thickness of 55 to110 nm; a transparent electrode pattern 4; a metal wiring section 6; asecond transparent resin layer 12; and a photosensitive transparentresin layer 7. The transparent laminate or capacitive input device ofthe invention is not intended to be limited to the configuration of FIG.1, and an embodiment in which the transparent film 11; the transparentelectrode pattern 4; the metal wiring section 6; the second transparentresin layer 12; and the photosensitive transparent resin layer 7 areprovided on only one surface of the transparent substrate 1 is alsopreferable.

Furthermore, FIG. 2, which illustrates a X-X′ cross-section shown inFIG. 4 that will be described below, is also a cross-sectional viewillustrating an exemplary preferred configuration of the capacitiveinput device of the invention. FIG. 2 illustrates an example of acapacitive input device in which a first transparent electrode patternand a second transparent electrode pattern are provided in twodirections that are approximately orthogonal to each other, namely, atransverse direction and a longitudinal direction, as a transparentelectrode pattern on one side of a transparent substrate. FIG. 2 showsan embodiment in which the capacitive input device 10 is configured toinclude a transparent substrate 1; a transparent film 11 having arefractive index of 1.60 to 1.78 and a film thickness of 55 to 110 nm; afirst transparent electrode pattern 3; a second transparent electrodepattern 4; a second transparent resin layer 12; and a photosensitivetransparent resin layer 7.

Regarding the transparent substrate (transparent film substrate or frontface plate) 1, the materials mentioned as the material for thetransparent electrode pattern of the transparent laminate of theinvention can be used.

An example of the capacitive input device of the invention having a masklayer is illustrated in FIG. 3. The mask layer 2 is a frame-shapedpattern provided around the display region of the touch paneltransparent substrate, and this is formed in order to make the leadwiring or the like invisible.

The capacitive input device 10 of the invention may be provided with, asillustrated in FIG. 3, a mask layer 2 so as to cover a partial region ofthe transparent substrate 1 (in FIG. 3, the region other than the inputsurface). Furthermore, the transparent substrate 1 may be provided withan opening 8 in a part, as illustrated in FIG. 3. A pressing-inducedmechanical switch can be provided at the opening 8.

An example of a capacitive input device having two layers of transparentelectrode patterns on one side of a transparent substrate is illustratedin FIG. 4. Formed on the surface of the transparent substrate 1 are: theplurality of first transparent electrode patterns 3 formed by theplurality of pad parts extending in a first direction through connectionparts; the plurality of second transparent electrode patterns 4,electrically insulated from the first transparent electrode patterns 3and formed by the plurality of pad parts extending in a direction thatperpendicularly intersects the first direction; and an insulating layer5 electrically insulating the first transparent electrode patterns 3 andthe second transparent electrode pattern 4. Regarding the firsttransparent electrode patterns 3, the second transparent electrodepatterns 4, and the metal wiring section 6 described below, materialsmentioned as the material for the transparent electrode pattern of thetransparent laminate of the invention can be used, and an ITO film ispreferred.

The first transparent electrode patterns 3 and the second transparentelectrode patterns 4 will be explained using FIG. 4. FIG. 4 is anexplanatory diagram illustrating an example of the first transparentelectrode pattern and the second transparent electrode pattern accordingto the invention. As illustrated in FIG. 4, the first transparentelectrode patterns 3 are formed by pad parts 3 a extending in a firstdirection through connection parts 3 b. Furthermore, the secondtransparent electrode patterns 4 are electrically insulated from thefirst transparent electrode pattern 3 by means of the insulating layer5, and are formed by the plurality of pad parts extending in a directionthat perpendicularly intersects the first direction (second direction inFIG. 4). Here, in the case of forming the first transparent electrodepatterns 3, the pad parts 3 a and the connection parts 3 b may beproduced as integrated bodies, or only the connection parts 3 b may beproduced, while the pad parts 3 a and the second transparent electrodepatterns 4 may be produced (patterned) as integrated bodies. In a casein which the pad parts 3 a and the second transparent electrode patterns4 are produced (patterned) as integrated bodies, as illustrated in FIG.4, various layers are formed such that portions of the connection parts3 b and portions of the pad parts 3 a are connected, while the firsttransparent electrode patterns 3 and the second transparent electrodepatterns 4 are electrically insulated by the insulating layer 5.

Furthermore, the region in FIG. 4 in which the first transparentelectrode patterns 3, the second transparent electrode patterns 4, orthe metal wiring section 6 that will be described below are not formed,corresponds to the non-patterned region 22 in the transparent laminateof the invention.

It is preferable that the metal wiring section 6 is provided on thesurface of the mask layer 2. The metal wiring section 6 is electricallyconnected to at least one of the first transparent electrode patterns 3or the second transparent electrode patterns 4, and is an elementdifferent from the first transparent electrode pattern 3 and the secondtransparent electrode patterns 4.

Furthermore, it is preferable that the photosensitive transparent resinlayer 7 is provided so as to cover all of the various constituentelements. The photosensitive transparent resin layer 7 may be configuredso as to cover only a portion of the various constituent elements. Theinsulating layer 5 and the photosensitive transparent resin layer 7 maybe formed from the same material, or may be formed from differentmaterials. Regarding the material that constitute the insulating layer5, the materials mentioned as the material for the photosensitivetransparent resin layer or the second transparent resin layer of thetransparent laminate of the invention can be preferably used.

(Method for Manufacturing Capacitive Input Device)

As exemplary embodiments that are formed during the process formanufacturing the capacitive input device of the invention, theembodiments illustrated in FIG. 5 to FIG. 9 may be mentioned. FIG. 5 isa top view illustrating an example of a toughened glass 11 having anopening 8 formed thereon. FIG. 6 is a top view illustrating an exampleof a transparent substrate having a mask layer 2 formed thereon. FIG. 7is a top view illustrating an example of a transparent substrate havinga first transparent electrode pattern 3 formed thereon. FIG. 8 is a topview illustrating an example of a transparent substrate having a firsttransparent electrode pattern 3 and a second transparent electrodepattern 4 formed thereon. FIG. 9 is a top view illustrating an exampleof a transparent substrate on which a metal wiring section 6 other thana photosensitive transparent resin layer and a second transparentelectrode pattern is formed. These illustrate examples that specificallyembody the following description, and the scope of the invention is notintended to be limitedly interpreted due to these drawings.

In regard to the method for manufacturing a capacitive input device, ina case in which the second transparent resin layer 12 and thephotosensitive transparent resin layer 7 are formed, the secondtransparent resin layer 12 and the photosensitive transparent resinlayer 7 can be formed by transferring the second transparent resin layerand the photosensitive transparent resin layer onto the surface of thetransparent substrate 1 on which various elements have been arbitrarilyformed, using the transfer film of the invention.

In regard to the method for manufacturing a capacitive input device, themask layer 2, the first transparent electrode pattern 3, the secondtransparent electrode pattern 4, the insulating layer 5, and metalwiring section 6 can also be formed using a photosensitive film having atemporary support and a photocurable resin layer as this order.

In a case in which permanent materials such as the mask layer and theinsulating layer, and the first transparent electrode pattern, thesecond transparent electrode pattern, and the metal wiring section incase of using a conductive photocurable resin layer are formed using theabove-mentioned photosensitive film, the photosensitive film islaminated on an optional transfer-receiving member, and then is exposedto light patternwise as necessary. Then, a pattern can be obtained byeliminating the unexposed parts in the case of a negative type material,and by eliminating the exposed parts in the case of a positive typematerial, through a developing treatment. Regarding the developing,thermoplastic resin layers and photocurable resin layers may bedeveloped and removed using different liquids, or may be removed usingthe same liquid. If necessary, a known developing facility such as abrush or a high-pressure jet may be used in combination. After thedeveloping, if necessary, post-exposure and post-bake treatments may beimplemented.

<Photosensitive Film>

The photosensitive film other than the transfer film of the invention,which is preferably used in the case of manufacturing the capacitiveinput device of the invention, will be explained. The photosensitivefilm has a temporary support and a photocurable resin layer, and it ispreferable that the photosensitive film has a thermoplastic resin layerbetween the temporary support and the photocurable resin layer. When amask layer and the like are formed using the aforementionedphotosensitive film having a thermoplastic resin layer, air bubbles arenot easily generated in the element formed by transferring thephotocurable resin layer, image unevenness or the like does not easilyoccur in the image display device, and excellent display characteristicscan be obtained.

The photosensitive film may be formed from a negative type material, ormay be formed from a positive type material.

—Method for Producing Layers Other than Photocurable Resin Layer—

Regarding the temporary support for the photosensitive film, a temporarysupport similar to that used for the transfer film of the invention canbe used. Regarding the thermoplastic resin layer used for thephotosensitive film, the thermoplastic resin layer described inparagraph 0056 to 0060 of JP2014-10814A can be used. It is alsoacceptable to use a known interlayer or oxygen barrier layer togetherwith the thermoplastic resin layer. Also, regarding the method forproducing the photosensitive film, a method similar to the method formanufacturing a transfer film of the invention can be used.

—Photocurable Resin Layer—

In the photosensitive film, additives are added to the photocurableresin layer according to the use applications. That is, in the case ofusing the photosensitive film for forming a mask layer, a colorant isincorporated into the photocurable resin layer.

In a case in which the photosensitive film is formed from a negativetype material, it is preferable that the photocurable resin layerincludes an alkali-soluble resin, a polymerizable compound, and apolymerization initiator or a polymerization initiator system.Furthermore, a colorant, other additives, and the like are used;however, the invention is not intended to be limited to these.

—Alkali-Soluble Resin, Polymerizable Compound, and PolymerizationInitiator—

Regarding the alkali-soluble resin, the polymerizable compound, and thepolymerization initiator or polymerization initiator system to beincluded in the photosensitive film, an alkali-soluble resin, apolymerizable compound, a polymerization initiator or a polymerizationinitiator system that are similar to those used for the transfer film ofthe invention can be used.

—Colorant (in Case of being Used as Mask Layer)—

Furthermore, in a case in which the photosensitive film is used as amask layer, a colorant can be used for the photocurable resin layer.Regarding the colorant that is used for the invention, known colorants(organic pigments, inorganic pigments, dyes, and the like) can besuitably used. According to the invention, in addition to a blackcolorant, a mixture of pigments of red, blue, and green colors and thelike can be used.

In a case in which the photocurable resin layer is used as a black masklayer, from the viewpoint of the optical density, it is preferable thatthe photocurable resin layer includes a black colorant. Examples of theblack colorant include carbon black, titanium carbon, iron oxide,titanium oxide, and graphite, and among them, carbon black is preferred.

In a case in which the photocurable resin layer is used as a white masklayer, the white pigments described in paragraph 0015 or 0114 ofJP2005-7765A can be used. In order to use the photocurable resin layeras a mask layer having another color, mixtures of the pigments describedin paragraphs 0183 to 0185 of JP4546276B, or mixtures of dyes may beused. Specifically, the pigments and dyes described in paragraphs 0038to 0054 of JP2005-17716A; the pigments described in paragraphs 0068 to0072 of JP2004-361447A; the colorants described in paragraphs 0080 to0088 of JP2005-17521A; and the like can be suitably used.

It is desirable that the colorant (preferably a pigment, and morepreferably carbon black) is used in the form of a dispersion liquid.This dispersion liquid can be prepared by adding a composition that isobtainable by mixing in advance a colorant and a pigment dispersingagent, to the organic solvent (or vehicle) that will be described below,and dispersing the composition therein. The term vehicle means theportion of a medium in which a pigment is dispersed, when paint is in aliquid state. The vehicle includes a component (binder) that is liquidand binds with the pigment to form a coating film, and a component(organic solvent) that dissolves and dilutes the aforementionedcomponent.

The dispersing machine that is used at the time of dispersing thepigment is not particularly limited, and examples thereof include knowndispersing machines such as a kneader, a roll mill, an attritor, aSUPERMILL, a DISSOLVER, a HOMOMIXER, and a SANDMILL, as described inAsakura, Kunizo, “Ganryo no Men (Dictionary of Pigments)”, 1^(st)Edition, Asakura Publishing Co., Ltd., 2000, p. 438. Furthermore, thepigment may also be finely pulverized by utilizing frictional force, bymeans of the mechanical attrition described in page 310 of theabove-described document.

Regarding the colorant, from the viewpoint of dispersion stability, acolorant having a number average particle size of 0.001 μm to 0.1 μm ispreferred, and a colorant having a number average particle size of 0.01μm to 0.08 μm is more preferred. The “particle size” as used hereinrefers to the diameter obtainable when an electron microscopicphotograph image of a particle is considered as a circle having the samearea. Regarding the “number average particle size”, the particle sizesof a large number of particles are determined, and the average value ofany 100 particle sizes selected from among these is designated as thenumber average particle size.

The film thickness of the photocurable resin layer including a colorantis preferably 0.5 to 10 μm, more preferably 0.8 to 5 μm, andparticularly preferably 1 to 3 μm, from the viewpoint of the differencein the film thickness between the resin layer and other layers. Thepercentage content of the colorant in the solid content of theabove-described colored photosensitive resin composition is notparticularly limited; however, from the viewpoint of sufficientlyshortening the developing time, the percentage content is preferably 15%to 70% by mass, more preferably 20% to 60% by mass, and even morepreferably 25% to 50% by mass.

The total solid content as used in the present specification means thetotal mass of nonvolatile components excluding solvents and the likefrom the colored photosensitive resin composition.

Furthermore, in a case in which an insulating layer is formed using thephotosensitive film, the layer thickness of the photocurable resin layeris preferably 0.1 to 5 μm, more preferably 0.3 to 3 μm, and particularlypreferably 0.5 to 2 μm, from the viewpoint of maintaining insulatingproperties.

—Other Additives—

The photocurable resin layer may also use other additives. Regarding theadditives, additives similar to those used for the transfer film of theinvention can be used. Regarding the solvent used for producing thephotosensitive film by application, a solvent similar to that used forthe transfer film of the invention can be used.

Thus, a case in which the photosensitive film is formed from a negativetype material has been mainly described; however, the photosensitivefilm may also be formed from a positive type material. In a case inwhich the photosensitive film is a positive type material, for example,the materials described in JP2005-221726A and the like are used for thephotocurable resin layer; however, the invention is not intended to belimited thereto.

—Viscosity of Thermoplastic Resin Layer and Photocurable Resin Layer—

It is preferable that the viscosity of the thermoplastic resin layermeasured at 100° C. is in the range of 1,000 to 10,000 Pa·sec, theviscosity of the photocurable resin layer measured at 100° C. is in therange of 2,000 to 50,000 Pa·sec, and the viscosities satisfy thefollowing Expression (A):Viscosity of thermoplastic resin layer<viscosity of photocurable resinlayer  Expression (A):

Here, the viscosity of each layer can be measured as follows. Ameasurement sample is produced by removing the solvent from a coatingliquid for a thermoplastic resin layer or a coating liquid for aphotocurable resin layer by drying under atmospheric pressure or reducedpressure. The viscosity is measured using, for example, a VIBRON (ModelDD-III; manufactured by Toyo Baldwin Co., Ltd.) as an analyzer, underthe conditions of a measurement initiation temperature of 50° C., ameasurement completion temperature of 150° C., a rate of temperatureincrease of 5° C./min, and a frequency of vibration of 1 Hz/deg. Themeasurement value obtained at 100° C. can be used.

(Formation of Mask Layer and Insulating Layer Using Photosensitive Film)

The mask layer 2 and the insulating layer 5 can be formed bytransferring the photocurable resin layer onto the transparent substrate1 or the like using the photosensitive film. For example, in the case offorming a black mask layer 2, the mask layer can be formed by using aphotosensitive film such as described above, which has a blackphotocurable resin layer as the photocurable resin layer, andtransferring the black photocurable resin layer onto the surface of thetransparent substrate 1. In the case of forming the insulating layer 5,the insulating layer can be formed by using a photosensitive film suchas described above, which has an insulating photocurable resin layer asthe photocurable resin layer, and transferring the photocurable resinlayer onto the surface of the transparent substrate 1 having a firsttransparent electrode pattern formed thereon.

Furthermore, when a photosensitive film such as described above, whichhas a particular layer configuration including a thermoplastic resinlayer between a photocurable resin layer and a temporary support, isused for the formation of a mask layer 2 that needs light shieldingproperties, air bubble generation at the time of photosensitive filmlamination is prevented, and thus a high-quality mask layer 2 and thelike, which are free from light leakage, can be formed.

<Formation of First Transparent Electrode Pattern, Second TransparentElectrode Pattern and Metal Wiring Section Using Photosensitive Film>

The first transparent electrode pattern 3, the second transparentelectrode pattern 4, and the metal wiring section 6 can be formed usingan etching treatment or the photosensitive film having a conductivephotocurable resin layer, or by using the photosensitive film as alift-off material.

—Etching Treatment—

In a case in which the first transparent electrode pattern 3, the secondtransparent electrode pattern 4, and the metal wiring section 6 areformed by an etching treatment, first, a transparent electrode layersuch as ITO is formed by sputtering on the non-contact surface of atransparent substrate 1 having a mask layer 2 and the like formedthereon. Subsequently, an etching pattern is formed by exposure anddeveloping, using a photosensitive film such as described above, whichhas a photocurable resin layer for etching as the photocurable resinlayer on the transparent electrode layer. Thereafter, the transparentelectrode layer is etched, thus the transparent electrode is patterned,and by eliminating the etching pattern, a first transparent electrodepattern 3 or the like can be formed.

Even in a case in which the photosensitive film is used as an etchingresist (etching pattern), a resist pattern can be obtained in the samemanner as the above-described method. Regarding the etching, etching andresist peeling can be applied by the known method described inparagraphs 0048 to 0054 of JP2010-152155A.

For example, regarding the method for etching, a wet etching method ofimmersing in an etching solution, which is generally practiced, may beused. Regarding the etching solution used for wet etching, an etchingsolution of an acidic type or an alkaline type may be selected asappropriate in accordance with the object of etching. Examples of theacidic type etching solution include an aqueous solution of an acidiccomponent alone, such as hydrochloric acid, sulfuric acid, hydrofluoricacid, or phosphoric acid; and a mixed aqueous solution of an acidiccomponent and a salt such as ferric chloride, ammonium fluoride, orpotassium permanganate. Regarding the acidic component, a combination ofa plurality of acidic components may also be used. Furthermore, examplesof the alkaline type etching solution include an aqueous solution of analkali component alone, such as sodium hydroxide, potassium hydroxide,ammonia, an organic amine, or a salt of an organic amine, such astetramethylammonium hydroxide; and a mixed aqueous solution of an alkalicomponent and a salt such as potassium permanganate. Regarding thealkali component, a combination of a plurality of alkali components mayalso be used.

The temperature of the etching solution is not particularly limited;however, the temperature is preferably 45° C. or lower. The resinpattern used as the etching mask (etching pattern) in the invention is aresin pattern formed using the photocurable resin layer described above,and exhibits especially excellent resistance to acidic and alkalineetching solutions in such a temperature range. Therefore, the resinpattern is prevented from being peeled off during the etching step, andthe parts where the resin pattern does not exist are selectively etched.

After the etching, in order to prevent line contamination, a washingstep and a drying step may be carried out as necessary. The washing stepmay be carried out by, for example, washing a transparent substrate onwhich various layers have been formed, using pure water at normaltemperature for 10 to 300 seconds. The drying step may be carried outusing air blowing, and by adjusting the air blow pressure (about 0.1 to5 kg/cm²) as appropriate.

Next, the method for peeling the resin pattern is not particularlylimited; however, for example, a method of immersing a transparentsubstrate on which various layers have been formed, for 5 to 30 minutesin a peeling solution that is being stirred at 30° C. to 80° C., andpreferably at 50° C. to 80° C., may be used. The resin pattern used asan etching mask in the invention exhibits excellent chemical resistanceat 45° C. or lower as explained above. However, when the chemical agenttemperature rises to 50° C. or higher, the resin pattern exhibits aproperty of being swollen by an alkaline peeling solution. Due to such aproperty, when a peeling step is carried out using a peeling solution at50° C. to 80° C., there is obtained an advantage that the duration ofthe step is shortened, and the amount of peeling residue of the resinpattern is reduced. That is, by providing a difference in the chemicalagent temperature between the etching step and the peeling step, theresin pattern used as the etching mask in the invention exhibitssatisfactory chemical resistance during the etching step, and exhibitssatisfactory peeling properties during the peeling step. Thus,contrasting characteristics such as chemical resistance and peelingproperties can be both satisfied.

Examples of the peeling solution include peeling solutions obtained bydissolving an inorganic alkali component such as sodium hydroxide orpotassium hydroxide, or an organic alkali component such as a tertiaryamine or a quaternary ammonium salt, in water, dimethyl sulfoxide,N-methylpyrrolidone, or a mixed solution thereof. Peeling may be carriedout using the peeling solution, by means of a spraying method, ashowering method, a paddling method or the like.

—Photosensitive Film Having Conductive Photocurable Resin Layer—

In a case in which the first transparent electrode pattern 3, the secondtransparent electrode pattern 4, and the metal wiring section 6 areformed using a photosensitive film such as described above, which has aconductive photocurable resin layer, these elements can be formed bytransferring the conductive photocurable resin layer onto the surface ofthe transparent substrate 1.

When the first transparent electrode pattern 3 and the like are formedusing the photosensitive film having a conductive photocurable resinlayer, even on a transparent substrate having an opening, leakage ofresist components through the opening portion does not occur, and atouch panel having advantages of being a thin layer and beinglightweight can be produced by a simple step, without contaminating thebackside of the substrate.

Furthermore, when a photosensitive film such as described above, whichhas a particular layer configuration having a thermoplastic resin layerbetween a conductive photocurable resin layer and a temporary support,is used for forming the first transparent electrode pattern 3 and thelike, air bubble generation at the time of photosensitive filmlamination is prevented, and a first transparent electrode pattern 3, asecond transparent electrode pattern 4, and a metal wiring section 6,all of which have excellent electrical conductivity and low resistance,can be formed.

—Use of Photosensitive Film as Lift-Off Material—

A first transparent electrode layer, a second transparent electrodelayer, and other conductive members can also be formed using thephotosensitive film as a lift-off material. In this case, patterning isperformed using the photosensitive film, subsequently a transparentconductive layer is formed over the entire surface of a transparentsubstrate on which various layers have been formed, and then dissolutionand removal of the photocurable resin layer together with the depositedtransparent conductive layer is carried out. Thus, a desired transparentconductive layer pattern can be obtained (lift-off method).

(Image Display Device)

The image display device of the invention includes the capacitive inputdevice of the invention as a constituent element.

In regard to the capacitive input device of the invention and an imagedisplay device including this capacitive input device as a constituentelement, the configurations disclosed in “Saishin Tatchipaneru Gijutsu(Latest Touch Panel Technologies)” (published by Techno Times Co., Ltd.,on Jul. 6, 2009); Mitani, Yuji, reviewed, “Tatchipaneru no Gijutsui toKaihatsu (Technology and Development of Touch Panels)”, published by CMCPublishing Co., Ltd. (December, 2004); FPD International 2009 ForumT-11, Lecture textbook; and Cypress Semiconductor CorporationApplication Note AN2292; and the like can be applied.

EXAMPLES

Hereinafter, the invention will be more specifically described by way ofExamples. The materials, the use amounts, proportions, details oftreatments, treatment procedures, and the like described in thefollowing Examples can be appropriately modified, as long as the gist ofthe invention is maintained. Therefore, the scope of the invention isnot intended to be limited to the specific examples described below.Meanwhile, unless particularly stated otherwise, the units “parts” and“%” are on a mass basis.

Examples 1 to 31 and Comparative Examples 1 to 7

1. Preparation of Each Composition

<Production of Composition for Forming Touch Panel Electrode ProtectiveFilm>

Composition 1 to Composition 33 which were the composition for forming atouch panel electrode protective film were produced using the variouscomponents described in the following Table 1 to Table 4.

TABLE 1 Composition 1 Composition 2 Composition 3 Composition 4Composition 5 Compound A-1 3.78 7.56 22.68 30.24 34.02 represented byA-2 — — — — — Formula 1 A-3 — — — — — A-4 — — — — — A-5 — — — — —Monomer having D-1 7.56 7.56 7.56 7.56 7.56 carboxy group D-2 — — — — —D-3 — — — — — D-4 — — — — — Other monomers F-1 41.58 37.80 22.68 15.1211.34 F-2 — — — — — F-3 22.68 22.68 22.68 22.68 22.68 F-4 — — — — — F-5— — — — — Binder polymer B-1 383.94 383.94 383.94 383.94 383.94 B-2 — —— — — Photopolymerization C-1 0.93 0.93 0.93 0.93 0.93 initiator C-20.93 0.93 0.93 0.93 0.93 C-3 — — — — — Other additives G-1 39.06 39.0639.06 39.06 39.06 G-2 3.78 3.78 3.78 3.78 3.78 G-3 0.20 0.20 0.20 0.200.20 Solvent E-1 131.84 131.84 131.84 131.84 131.84 E-2 363.71 363.71363.71 363.71 363.71 Total 1000.0 1000.0 1000.0 1000.0 1000.0 Ratio ofComponent A with 5% 10% 30% 40% 45% respect to entire monomer componentsComposition Composition 6 Composition 7 Composition 8 Composition 9 10Compound A-1 — — — — — represented by A-2 7.56 30.24 — — — Formula 1 A-3— — 30.24 — — A-4 — — — 22.68 — A-5 — — — — 22.68 Monomer having D-17.56 7.56 7.56 7.56 7.56 carboxy group D-2 — — — — — D-3 — — — — — D-4 —— — — — Other monomers F-1 37.80 15.12 15.12 22.68 22.68 F-2 — — — — —F-3 22.68 22.68 22.68 22.68 22.68 F-4 — — — — — F-5 — — — — — Binderpolymer B-1 383.94 383.94 383.94 383.94 383.94 B-2 — — — — —Photopolymerization C-1 0.93 0.93 0.93 0.93 0.93 initiator C-2 0.93 0.930.93 0.93 0.93 C-3 — — — — — Other additives G-1 39.06 39.06 39.06 39.0639.06 G-2 3.78 3.78 3.78 3.78 3.78 G-3 0.20 0.20 0.20 0.20 0.20 SolventE-1 131.84 131.84 131.84 131.84 131.84 E-2 363.71 363.71 363.71 363.71363.71 Total 1000.0 1000.0 1000.0 1000.0 1000.0 Ratio of Component Awith 10% 40% 40% 30% 30% respect to entire monomer components

TABLE 2 Composition Composition Composition Composition Composition 1112 13 14 15 Compound A-1 22.68 — 34.40 22.68 28.73 represented by A-2 —22.68 — — — Formula 1 A-3 — — — — — A-4 — — — — — A-5 — — — — — Monomerhaving D-1 7.56 7.56 11.47 7.56 1.51 carboxy group D-2 — — — — — D-3 — —— — — D-4 — — — — — Other monomers F-1 22.68 22.68 34.40 22.68 22.68 F-2— — — — — F-3 22.68 22.68 34.40 22.68 22.68 F-4 — — — — — F-5 — — — — —Binder polymer B-1 383.94 383.94 383.94 — 383.94 B-2 — — — 383.94 —Photopolymerization C-1 0.93 — 0.93 0.93 0.93 initiator C-2 — — 0.930.93 0.93 C-3 — 0.93 — — — Other additives G-1 39.06 39.06 — 39.06 39.06G-2 — 3.78 3.78 3.78 3.78 G-3 0.20 0.20 0.20 0.20 0.20 Solvent E-1131.84 131.84 131.84 131.84 131.84 E-2 368.42 364.64 363.71 363.71363.71 Total 1000.0 1000.0 1000.0 1000.0 1000.0 Ratio of Component Awith 30% 30% 30% 30% 38% respect to entire monomer componentsComposition Composition Composition Composition Composition 16 17 18 1920 Compound A-1 26.46 15.12 30.24 16.69 27.25 represented by A-2 — — — —— Formula 1 A-3 — — — — — A-4 — — — — — A-5 — — — — — Monomer having D-13.78 15.12 30.24 5.56 9.08 carboxy group D-2 — — — — — D-3 — — — — — D-4— — — — — Other monomers F-1 22.68 22.68 7.56 16.69 27.25 F-2 — — — — —F-3 22.68 22.68 7.56 16.69 27.25 F-4 — — — — — F-5 — — — — — Binderpolymer B-1 383.94 383.94 383.94 443.91 338.25 B-2 — — — — —Photopolymerization C-1 0.93 0.93 0.93 0.68 1.12 initiator C-2 0.93 0.930.93 0.68 1.12 C-3 — — — — — Other additives G-1 39.06 — 39.06 39.0639.06 G-2 3.78 3.78 3.78 2.78 4.54 G-3 0.20 0.20 0.20 0.20 0.20 SolventE-1 131.84 131.84 131.84 105.57 151.85 E-2 363.71 402.77 363.71 351.49373.04 Total 1000.0 1000.0 1000.0 1000.0 1000.0 Ratio of Component Awith 35% 20% 40% 30% 30% respect to entire monomer components

TABLE 3 Composition 21 Composition 22 Composition 23 Composition 24Composition 25 Composition 26 Compound represented by A-1 22.68 22.6822.68 22.68 30.24 34.02 Formula 1 A-2 — — — — — — A-3 — — — — — — A-4 —— — — — — A-5 — — — — — — Monomer having carboxy D-1 7.56 7.56 7.56 — —— group D-2 — — — 7.56 — — D-3 — — — — 7.56 — D-4 — — — — — 7.56 Othermonomers F-1 — — 37.80 22.68 15.12 11.34 F-2 — 7.56 7.56 — — — F-3 45.3637.80 — 22.68 22.68 22.68 F-4 — — — — — — F-5 — — — — — — Binder polymerB-1 383.94 383.94 383.94 383.94 383.94 383.94 B-2 — — — — — —Photopolymerization C-1 0.93 0.93 0.93 0.93 0.93 0.93 initiator C-2 0.930.93 0.93 0.93 0.93 0.93 C-3 — — — — — — Other additives G-1 39.06 39.0639.06 39.06 39.06 39.06 G-2 3.78 3.78 3.78 3.78 3.78 3.78 G-3 0.20 0.200.20 0.20 0.20 0.20 Solvent E-1 131.84 131.84 131.84 131.84 131.84131.84 E-2 363.71 363.71 363.71 363.71 363.71 363.71 Total 1000.0 1000.01000.0 1000.0 1000.0 1000.0 Ratio of Component A with respect to 30% 30%30% 30% 40% 45% entire monomer components

TABLE 4 Composition 27 Composition 28 Composition 29 Composition 30Composition 31 Composition 32 Composition 33 Compound represented A-145.36 68.04 30.24 — — — — by Formula 1 A-2 — — — — — — — A-3 — — — — — —— A-4 — — — — — — — A-5 — — — — — — — Monomer having D-1 7.56 7.56 —7.56 7.56 7.56 7.56 carboxy group D-2 — — — — — — — D-3 — — — — — — —D-4 — — — — — — — Other monomers F-1 15.12 — 22.68 22.68 22.68 22.68 —F-2 — — — — — 22.68 45.36 F-3 7.56 — 22.68 22.68 22.68 22.68 22.68 F-4 —— — 22.68 — — — F-5 — — — — 22.68 — — Binder polymer B-1 383.94 383.94383.94 383.94 383.94 383.94 383.94 B-2 — — — — — — — PhotopolymerizationC-1 0.93 0.93 0.93 0.93 0.93 0.93 0.93 initiator C-2 0.93 0.93 0.93 0.930.93 0.93 0.93 C-3 — — — — — — — Other additives G-1 39.06 39.06 39.0639.06 39.06 39.06 39.06 G-2 3.78 3.78 3.78 3.78 3.78 3.78 3.78 G-3 0.200.20 0.20 0.20 0.20 0.20 0.20 Solvent E-1 131.84 131.84 131.84 131.84131.84 131.84 131.84 E-2 363.71 363.71 363.71 363.71 363.71 363.71363.71 Total 1000.0 1000.0 1000.0 1000.0 1000.0 1000.0 1000.0 Ratio ofComponent A with 60% 90% 40% 0% 0% 0% 0% respect to entire monomercomponents

The compounds represented by the reference numerals in Table 1 to Table4 are as follows.

[Component A]

A-1: 1,9-Nonanediol diacrylate (bifunctional, A-NOD-N, manufactured byShin-Nakamura Chemical Co., Ltd.)

A-2: 1,10-Decanediol diacrylate (bifunctional, A-DOD-N, manufactured byShin-Nakamura Chemical Co., Ltd.)

A-3: Neopentyl glycol dimethacrylate (bifunctional, NPG, manufactured byShin-Nakamura Chemical Co., Ltd.)

A-4: Tripropylene glycol diacrylate (bifunctional, APG-200, manufacturedby Shin-Nakamura Chemical Co., Ltd.)

A-5: Polypropylene glycol #200 diacrylate (bifunctional, A-200,manufactured by Shin-Nakamura Chemical Co., Ltd.)

[Component D]

D-1: Polybasic acid-modified acrylic oligomer TO-2349 (mixture ofdipentaerythritol hexa(meth)acrylate, dipentaerythritolpenta(meth)acrylate, and succinic acid ester of dipentaerythritolpenta(meth)acrylate, pentafunctional to hexafunctional, manufactured byToagosei Co., Ltd.)

D-2: 2-Acryloyloxyethyl succinate (monofunctional, manufactured byKyoeisha Chemical Co., Ltd.)

D-3: Polybasic acid-modified acrylic oligomer M-510 (trifunctional totetrafunctional, manufactured by Toagosei Co., Ltd.)

D-4: Polybasic acid-modified acrylic monomer DPE6A-MS (denatured productof dipentaerythritol pentaacrylate-succinic acid, pentafunctional tohexafunctional, manufactured by Kyoeisha Chemical Co., Ltd.)

[Component F]

F-1: Tricyclodecanedimethanol diacrylate (bifunctional, A-DCP,manufactured by Shin-Nakamura Chemical Co., Ltd.)

F-2: Dipentaerythritol hexaacrylate (hexafunctional, A-DPH, manufacturedby Shin-Nakamura Chemical Co., Ltd.)

F-3: Urethane acrylate 8UX-015A (pentadecafunctional, Mw=1,000 to 2,000,manufactured by Taisei Fine Chemical Co, Ltd.)

F-4: Isoamyl acrylate (monofunctional, LIGHT ACRYLATE IAA, manufacturedby Kyoeisha Chemical Co., Ltd.)

F-5: Ethoxylated isocyanuric acid triacrylate (trifunctional, A-9300,manufactured by Shin-Nakamura Chemical Co., Ltd.)

[Component B]

B-1: Polymer solution 1 (polymer shown below, weight-average molecularweight=35,000, acid value: 75 mg KOH/g, PGMEA solution (solid content45%))

B-2: Polymer solution 2 (copolymer of methacrylic acid/methylmethacrylate/butyl methacrylate; weight-average molecular weight 60,000,molar compositional ratio=30/30/40, acid value 106 mg KOH/g, PGMEAsolution (solid content 45%))

In B-1, the numerical values at the lower right of parentheses representmolar ratios.

[Component C]

C-1:1[9-Ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone-1-(0-acetyloxime)(IRGACURE OXE-02, manufactured by BASF SE)

C-2: 2-Methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one (IRGACURE907, manufactured by BASF SE)

C-3: 1-[4-(phenylthio)]-1,2-octanedione-2-(O-benzoyloxime) (IRGACUREOXE-01, manufactured by BASF SE)

[Additives]

G-1: DURANATE TPA-B80E (manufactured by Asahi Kasei ChemicalsCorporation)

G-2: Hydroquinone monomethyl ether (manufactured by FujifilmCorporation)

G-3: MEGAFACE F780 (manufactured by DIC Corporation)

[Component E]

E-1: 1-Methoxy-2-propyl acetate

E-2: Methyl ethyl ketone

<Production of Composition for Forming Second Transparent Resin Layer>

Next, Compositions B-1 to B-5 as the composition for forming a secondtransparent resin layer were produced using the various componentsdescribed in the following Table 5.

TABLE 5 Solvent Dispersion liquid Resin Distilled Parts Parts waterMethanol Dispersion by by (parts by (parts by Type medium mass Type massmass) mass) B-1 NANOUSE OZ-S30M Methanol 4.30 Polymer-C 8.46 56.00 31.19B-2 NANOUSE OZ-S30M Methanol 4.10 Polymer-A 0.43 20.00 75.47 B-3 NANOUSEOZ-S30M Methanol 3.95 Polymer-C 8.46 60.00 27.49 B-4 NANOUSE OZ-S30MMethanol 3.70 Polymer-C 8.46 40.00 47.84 B-5 NANOUSE OZ-S30M Methanol5.20 Polymer-C 8.20 40.00 46.50 Additive-2 Concentration Additive-1Parts of solid Concentration Parts by by content of ZrO₂ Type mass Typemass Total (% by mass) (% by mass) B-1 Benzotriazole 0.05 — 0.00 100.001.78 73.49 B-2 — 0.00 — 0.00 100.00 1.68 74.41 B-3 I-1 0.003 J-2 0.10100.00 1.73 69.61 B-4 — 0.00 — 0.00 100.00 1.55 72.74 B-5 Benzotriazole0.05 J-2 0.05 100.00 2.10 75.67

NANOUSE OZ-S30M; manufactured by Nissan Chemical Industries, Ltd.,inorganic particles (30.5%) containing zirconium oxide and tin oxide

Polymer-A: Copolymerized resin of methacrylic acid/methyl methacrylate(Mw: 15,000, molar compositional ratio=40/60)

Polymer-C: Ammonia aqueous solution (pH=9.0) of copolymerized resin ofmethacrylic acid/methyl methacrylate (Mw: 15,000, molar compositionalratio=40/60, non-volatile fraction 5%)

I-1: Water-soluble photopolymerization initiator (IRGACURE 2959,manufactured by BASF Japan Ltd.)

J-2: ARONIX TO-2349 (manufactured by Toagosei Co., Ltd.)

2. Production of Transfer Film

Composition 1 to Composition 33 obtained above were applied on atemporary support, which was a polyethylene terephthalate film having athickness of 16 μm, using a slit-like nozzle, while changing the coatingamount so as to obtain the film thickness of 8 μm. The solvent of thecoated film was volatilized in a dry zone at 120° C., and then aphotosensitive transparent resin layer was formed. Then, each ofCompositions B-1 to B-5 for a second transparent resin layer obtainedabove was applied on the photosensitive transparent resin layer, using aslit-like nozzle, while changing the coating amount so as to obtain afilm thickness of 0.1 μm, and the composition was dried. After drying,the second transparent resin layer was covered with a protective film. Alaminate in which the temporary support, the photosensitive transparentresin layer, the second transparent resin layer, and the protectivefilm, each produced as described in Table 7, were formed in this orderwas used as the transfer film of each of various Examples andComparative Examples.

3. Production of Transparent Electrode Pattern Film Used for Productionof Transparent Laminate

<Formation of Transparent Film>

A cycloolefin resin film having a film thickness of 38 μm and arefractive index of 1.53 was subjected to a corona discharge treatmentfor 3 seconds at an output voltage of 100% and an output power of 250 W,using a wire electrode having a diameter of 1.2 mm under the conditionsof an electrode length of 240 mm and a working electrode distance of 1.5mm, using a high frequency oscillator. Thus, surface modification wasperformed, and thereby a transparent film substrate was obtained.

Next, Material-C indicated in the following Table 6 was applied on thetransparent film substrate using a slit-like nozzle, and then Material-Cwas irradiated with ultraviolet radiation (cumulative amount of light300 mJ/cm²) and dried at about 110° C. Thus, a transparent film having arefractive index of 1.60 and a film thickness of 80 nm was produced.

TABLE 6 Material Material-C ZrO₂: ZR-010 manufactured by Solar Co., Ltd.2.08 DPHA liquid (dipentaerythritol hexaacrylate: 38%, 0.29dipentaerythritol pentaacrylate: 38%, 1-methoxy- 2-propyl acetate: 24%)Urethane-based monomer: UK OLIGOMER UA- 0.14 32P, manufactured byShin-Nakamura Chemical Co., Ltd.: non-volatile fraction 75%, 1-methoxy-2-propyl acetate: 25% Monomer mixture (polymerizable compound 0.36(b2-1) described in paragraph 0111 of JP2012- 78528A, n = 1:tripentaerythritol octaacrylate percentage content 85%, sum of n = 2 andn = 3 as impurities is 15%) Polymer solution 1 (B-1: weight-average 1.89molecular weight = 35,000, solid content 45%, 1-methoxy-2-propyl acetate15%, 1-methoxy- 2-propanol 40%) Photoradical polymerization initiator:0.03 2-benzyl-2-dimethylamino-1-(4- morpholinophenyl)-1-butanone(IRGACURE 369, manufactured by BASF SE) Photopolymerization initiator:KAYACURE- 0.03 DETX-S (manufactured by Nippon Kayaku Co., Ltd.,alkylthioxanthone) MEGAFACE F444 (manufactured by DIC 0.01 Corporation)1-Methoxy-2-propyl acetate 38.73 Methyl ethyl ketone 56.80 Total (partsby mass) 100

<Formation of Transparent Electrode Pattern>

The film having a transparent film laminated on a transparent filmsubstrate obtained as described above was introduced into a vacuumchamber, and an ITO thin film having a thickness of 40 nm and arefractive index of 1.82 was formed by direct current (DC) magnetronsputtering (conditions: temperature of transparent film substrate 150°C., argon pressure 0.13 Pa, and oxygen pressure 0.01 Pa) using an ITOtarget (indium:tin=95:5 (molar ratio)) having a SnO₂ percentage contentof 10% by mass. Thus, a film in which a transparent film and atransparent electrode layer were formed on a transparent film substratewas obtained. The surface electrical resistance of the ITO thin film was80 Ω/□.

<Production of Photosensitive Film for Etching E1>

On a polyethylene terephthalate film temporary support having athickness of 75 μm, a coating liquid for a thermoplastic resin layerformed from Formulation H1 described below was applied using a slit-likenozzle and was dried. Next, a coating liquid for an interlayer formedfrom Formulation P1 described below was applied and was dried.Furthermore, a coating liquid for a photocurable resin layer for etchingformed from Formulation E1 described below was applied and dried. Inthis manner, a laminate in which a thermoplastic resin layer having adried film thickness of 15.1 μm, an interlayer having a dried filmthickness of 1.6 μm, and a photocurable resin layer for etching having afilm thickness of 2.0 μm were formed on a temporary support, wasobtained. A protective film (polypropylene film having a thickness of 12μm) was pressure-bonded onto the photocurable resin layer for etching ofthe laminate. Thus, a photosensitive film for etching, which was atransfer material in which a temporary support, a thermoplastic resinlayer, an interlayer (oxygen barrier film), and a photocurable resinlayer for etching were integrated, was produced.

—Coating Liquid for Photocurable Resin Layer for Etching: FormulationE1—

-   -   Methyl methacrylate/styrene/methacrylic acid copolymer

(copolymer composition (% by mass): 31/40/29, weight-average molecularweight 60,000, acid value 163 mg KOH/g): 16 parts

-   -   Monomer 1 (trade name: BPE-500, manufactured by Shin-Nakamura        Chemical Co., Ltd.): 5.6 parts    -   Tetraethylene oxide monomethacrylate 0.5 mol-adduct of        hexamethylene diisocyanate: 7 parts    -   Cyclohexanedimethanol monoacrylate as compound having one        polymerizable group in molecule: 2.8 parts    -   2-Chloro-N-butylacridone: 0.42 parts    -   2,2-Bis(o-chlorophenyl)-4,4′,5,5′-tetraphenylbiimidazole: 2.17        parts    -   Malachite Green oxalate: 0.02 parts    -   Leuco Crystal Violet: 0.26 parts    -   Phenothiazine: 0.013 parts    -   Surfactant (trade name: MEGAFACE F-780F, manufactured by DIC        Corporation): 0.03 parts    -   Methyl ethyl ketone: 40 parts    -   1-Methoxy-2-propanol: 20 parts

The viscosity at 100° C. after solvent removal of the coating liquid fora photocurable resin layer for etching E1 was 2,500 Pa·sec.

—Coating Liquid for Thermoplastic Resin Layer: Formulation H1—

-   -   Methanol: 11.1 parts    -   Propylene glycol monomethyl ether acetate: 6.36 parts    -   Methyl ethyl ketone: 52.4 parts    -   Methyl methacrylate/2-ethylhexyl acrylate/benzyl        methacrylate/methacrylic acid copolymer (copolymerization        compositional ratio (molar ratio)=55/11.7/4.5/28.8, molecular        weight=100,000, Tg≈70° C.): 5.83 parts    -   Styrene/acrylic acid copolymer (copolymerization compositional        ratio (molar ratio)=63/37, weight-average molecular        weight=10,000, Tg 100° C.): 13.6 parts    -   Monomer-1 (trade name: BPE-500, manufactured by Shin-Nakamura        Chemical Co., Ltd.): 9.1 parts    -   Fluorine-based polymer: 0.54 parts

The fluorine-based polymer was a copolymer of 40 parts ofC₆F₁₃CH₂CH₂OCOCH═CH₂, 55 parts of H(OCH(CH₃)CH₂)₇OCOCH═CH₂, and 5 partsof H(OCHCH₂)₇OCOCH═CH₂, having a weight-average molecular weight of30,000, in the form of a 30 mass % solution in methyl ethyl ketone(trade name: MEGAFACE F780F, manufactured by DIC Corporation).

—Coating Liquid for Interlayer: Formulation P1—

-   -   Polyvinyl alcohol: 32.2 parts

(PVA205, manufactured by Kuraray Co., Ltd., degree ofsaponification=88%, degree of polymerization 550)

-   -   Polyvinylpyrrolidone: 14.9 parts

(K-30, manufactured by ISP Japan, Ltd.)

-   -   Distilled water: 524 parts    -   Methanol: 429 parts

<Formation of Transparent Electrode Pattern>

A film having a transparent film and a transparent electrode layerformed on a transparent film substrate was washed, and thephotosensitive film for etching E1, from which the protective film hadbeen removed, was laminated such that the transparent electrode layerand the surface of the photocurable resin layer for etching would faceeach other (temperature of transparent film substrate 130° C., rubberroller temperature 120° C., linear pressure 100 N/cm, conveyance speed2.2 m/min). Next, the temporary support was peeled off, and then thephotosensitive film was patternwise exposed at an amount of exposure of50 mJ/cm² (i-line) by setting the distance between an exposure mask(quartz exposure mask having a transparent electrode pattern) surfaceand the photocurable resin layer for etching to 200 μm.

Next, the resultant was subjected to a developing treatment for 100seconds at 25° C. using a triethanolamine-based developer (containing30% by mass of triethanolamine, liquid obtained by diluting trade name:T-PD2 (manufactured by Fujifilm Corporation) 10 times with pure water),and to a washing treatment for 20 seconds at 33° C. using asurfactant-containing washing liquid (liquid obtained by diluting tradename: T-SD3 (manufactured by Fujifilm Corporation) 10 times with purewater), and residue removal was carried out using a rotating brush whilespraying ultrapure water through an ultrahigh pressure washing nozzle.The resultant was further subjected to a post-bake treatment for 30minutes at 130° C. Thus, a film having a transparent film, a transparentelectrode layer, and a photocurable resin layer pattern for etchingformed on a transparent film substrate was obtained.

The film having a transparent film, a transparent electrode layer, and aphotocurable resin layer pattern for etching formed on a transparentfilm substrate was immersed in an etching tank containing an ITO etchant(hydrochloric acid, aqueous solution of potassium chloride, liquidtemperature: 30° C.) and subjected to an etching treatment for 100seconds. Thus, the transparent electrode layer in an exposed region thatwas not covered by the photocurable resin layer for etching wasdissolved and removed, and then a transparent electrode pattern-attachedfilm having a photocurable resin layer pattern for etching was obtained.

Next, the transparent electrode pattern-attached film having aphotocurable resin layer pattern for etching was immersed in a resistpeeling tank containing a resist peeling solution (liquid containingN-methyl-2-pyrrolidone, monoethanolamine, and a surfactant (trade name:SURFYNOL 465, manufactured by Air Products & Chemicals, Inc.), liquidtemperature 45° C.) and was subjected to a peeling treatment for 200seconds. Thus, the photocurable resin layer for etching was removed, andthen a film having a transparent film and a transparent electrodepattern formed on a transparent film substrate was obtained.

4. Production of Transparent Laminates of Various Examples andComparative Examples

Each of the transfer films of various Examples and Comparative Exampleswas transferred such that the second transparent resin layer of each ofthe transfer films of various Examples and Comparative Examples wouldcover the transparent film and the transparent electrode pattern of thefilm having a transparent film and a transparent electrode patternformed on a transparent film substrate (temperature of transparent filmsubstrate: 40° C., rubber roller temperature: 110° C., linear pressure:3 N/cm, conveyance speed: 2 m/min).

Subsequently, the transparent laminate was patternwise exposed at anamount of exposure of 100 mJ/cm² (i-line) through the temporary support,using a proximity type exposure machine (manufactured by HitachiHigh-Tech Electronics Engineering Co., Ltd.) having an ultrahighpressure mercury lamp, by setting the distance between the exposure mask(quartz exposure mask having a pattern for forming an overcoat) surfaceand the temporary support to 125 μm. After the temporary support waspeeled off, the transparent laminate was subjected to a washingtreatment for 60 seconds using a 2% aqueous solution of sodium carbonateat 32° C. Ultrapure water was sprayed onto the transparent filmsubstrate after the washing treatment, through an ultrahigh pressurewashing nozzle, and thus residue was removed. Subsequently, air wasblown to remove water on the transparent film substrate, and thetransparent laminate was subjected to post exposure at an amount ofexposure of 400 mJ/cm² under an atmosphere and was subjected to apost-bake treatment for 30 minutes at 145° C. In this manner, each ofthe transparent laminates of various Examples and Comparative Examples,in which a transparent film, a transparent electrode pattern, a secondtransparent resin layer, and a photosensitive transparent resin layerwere continuously formed on a transparent film substrate in this order,was formed.

5. Evaluation of Transparent Laminate

<Evaluation of Bending Resistance>

Each of the transparent laminates of various Examples and ComparativeExamples obtained after patternwise exposure and post exposure wasprovided such that the temporary support was in contact with a mandrelof a bending test device, and a mandrel bending test was performed.Observation with a microscope was performed to see the presence orabsence of chipping in each transparent laminate thus obtained, anddiameters of mandrels in which chipping did not occur are described inTable 7.

<Evaluation of Static Friction>

Each of Composition 1 to Composition 33 was applied on a temporarysupport, which was a polyethylene terephthalate film having a thicknessof 16 μm, using a slit-like nozzle, while changing the coating amount soas to obtain the film thickness of 8 μm. Then, the composition was driedand a photosensitive transparent resin layer is obtained. A sampleobtained in this manner was used as a sample for measuring staticfriction. A coefficient of static friction between the photosensitivetransparent resin layer of each sample and stainless steel was measuredfive times using TR-2 manufactured by Toyo Seiki Seisaku-sho, Ltd., andthe average value thereof was evaluated. The evaluation results aredescribed in Table 7.

As a value of the coefficient of static friction is smaller, it is morepreferable. Moreover, in a case were a sample has a coefficient ofstatic friction of 1.5 or more, there are concerns that slidingproperties between the photosensitive transparent resin layer and thestainless steel which is a member such as a conveying roll deteriorate,and wrinkles are generated at the time of producing a transfer film.

<Evaluation of Adhesiveness>

A 100-square grid cross-cut test was carried out by making reference tothe JIS standards (K 5400). Incisions were inserted in a lattice patternsuch that each side measured 1 mm, using a cutter knife, on thephotosensitive transparent resin layer that was the test surface of eachof the transparent laminates of various Examples and ComparativeExamples, and transparent pressure-sensitive tape #600 (manufactured by3M Company) was strongly pressure-bonded thereto. The tape was peeledoff in the 180° direction, and then the state of the lattice pattern wasobserved. Thus, adhesiveness was evaluated according to the followingcriteria. Grade A, B or C is necessary for practical use, and Grade A orB is preferred, while Grade A is more preferred. The evaluation resultsare summarized in Table 7.

—Evaluation Standard—

A: Almost 100% of the entire area is closely adhered.

B: 95% or more and less than 100% of the entire area remains closelyadhered.

C: 65% or more and less than 95% of the entire area remains closelyadhered.

D: 35% or more and less than 65% of the entire area remains closelyadhered.

E: The portion remaining closely adhered is less than 35% of the entirearea.

<Evaluation of Transparent Electrode Pattern Concealability>

Each of the transparent laminates of various Examples and ComparativeExamples was adhered to a black PET material, with a transparentadhesive tape (manufactured by 3M Company, trade name: OCA TAPE 8171CL)being interposed therebetween, and the entire transparent film substratewas shielded from light. That is, the black PET material was provided ona surface on a side on which a transparent film or the like was notlaminated, among both surfaces of the transparent film.

Subsequently, light was caused to enter through a surface on a side onwhich the black PET material was not provided, among both surfaces ofthe transparent laminate, and the reflected light was observed.Specifically, the light was caused to enter from the second transparentresin layer side using a fluorescent lamp (light source) in a dark room,and the light reflected at the surface of the second transparent resinlayer was visually observed from an oblique direction. Grade A, B, C orD is preferred; Grade A, B or C is more preferred; Grade A or B isparticularly preferred; and Grade A is most preferred. The evaluationresults are described in Table 7.

—Evaluation Standard—

A: The transparent electrode pattern is not at all seen.

B: The transparent electrode pattern is slightly seen but almostinvisible.

C: The transparent electrode pattern is seen but details of the patternare not seen.

D: The transparent electrode pattern is seen but to an acceptable level.

E: The transparent electrode pattern is clearly seen.

TABLE 7 Photosensitive Composition for second transparent transparentresin Coefficient Transparent resin layer Refractive Bending of staticAdhesive- electrode pattern Material Thickness Material index resistancefriction ness concealability Example 1 Composition 1  8 μm B-1 1.65 2 mm0.3 A A Example 2 Composition 2  8 μm B-1 1.65 2 mm 0.4 A A Example 3Composition 3  8 μm B-1 1.65 1.5 mm   0.4 A A Example 4 Composition 4  8μm B-1 1.65 1.5 mm   0.5 A A Example 5 Composition 5  8 μm B-1 1.65 1.5mm   0.6 A A Example 6 Composition 6  8 μm B-1 1.65 2 mm 0.3 A A Example7 Composition 7  8 μm B-1 1.65 1.5 mm   0.3 A A Example 8 Composition 8 8 μm B-1 1.65 2 mm 0.3 A A Example 9 Composition 9  8 μm B-1 1.65 2 mm0.4 A A Example 10 Composition 10 8 μm B-1 1.65 2 mm 0.2 A A Example 11Composition 11 8 μm B-1 1.65 2 mm 0.3 A A Example 12 Composition 12 8 μmB-1 1.65 2 mm 0.3 A A Example 13 Composition 13 8 μm B-1 1.65 2 mm 0.3 AA Example 14 Composition 14 8 μm B-1 1.65 2 mm 0.2 A A Example 15Composition 15 8 μm B-1 1.65 2 mm 0.4 C A Example 16 Composition 16 8 μmB-1 1.65 2 mm 0.3 B A Example 17 Composition 17 8 μm B-1 1.65 2 mm 0.3 AA Example 18 Composition 18 8 μm B-1 1.65 2 mm 0.3 A A Example 19Composition 19 8 μm B-1 1.65 2 mm 0.3 A A Example 20 Composition 20 8 μmB-1 1.65 1.5 mm   0.6 A A Example 21 Composition 21 8 μm B-1 1.65 2 mm0.3 A A Example 22 Composition 22 8 μm B-1 1.65 2 mm 0.3 A A Example 23Composition 23 8 μm B-1 1.65 2 mm 0.3 A A Example 24 Composition 24 8 μmB-1 1.65 2 mm 0.3 A A Example 25 Composition 25 8 μm B-1 1.65 2 mm 0.4 AA Example 26 Composition 26 8 μm B-1 1.65 2 mm 0.4 A A Example 27Composition 4  8 μm B-2 1.65 2 mm 0.3 A A Example 28 Composition 4  8 μmB-3 1.65 2 mm 0.3 A A Example 29 Composition 4  8 μm B-4 1.65 2 mm 0.3 AA Example 30 Composition 4  8 μm B-5 1.65 2 mm 0.3 A A Example 31Composition 4  8 μm None 1.65 2 mm 0.3 A D Comparative Composition 27 8μm B-1 1.65 1.5 mm   1.5 or more A A Example 1 Comparative Composition28 8 μm B-1 1.65 1.5 mm   1.5 or more A A Example 2 ComparativeComposition 29 8 μm B-1 1.65 2 mm 0.3 E A Example 3 ComparativeComposition 30 9 μm B-1 1.65 1.5 mm   1.5 or more A A Example 4Comparative Composition 31 10 μm  B-1 1.65 4 mm 0.4 A A Example 5Comparative Composition 32 8 μm B-1 1.65 4 mm 0.3 A A Example 6Comparative Composition 33 8 μm B-1 1.65 6 mm 0.2 A A Example 7

From Table 7 described above, it was understood that the transfer filmsof the invention exhibited satisfactory bending resistance of thephotosensitive transparent resin layer after transfer. On the otherhand, in Comparative Examples 5 to 7 that did not contain the compoundrepresented by Compound A, results with poor bending resistance wereobtained. Moreover, in Comparative Example 4 in which a monofunctionalmonomer was used, and Comparative Examples 1 and 2 in which the compoundrepresented by Formula 1 occupied 50% or more of the entire monomercomponents, the coefficient of static friction was significantly high,and thus a problem of wrinkles or the like may be generated at the timeof producing a transfer film.

In Comparative Example 3 that did not contain Component D, a result withpoor adhesiveness was obtained.

In addition to that, in the transfer film of Example 31 that did nothave the second transparent resin layer, concealability of thetransparent electrode pattern was slightly inferior and patterns of ITOwiring were slightly visible.

(Production of Image Display Device (Touch Panel))

A film including each of the transparent laminates of various Examplesproduced previously was bonded to a liquid crystal display deviceproduced by the method described in paragraphs 0097 to 0119 ofJP2009-47936A, and a front glass plate was bonded thereto. Thus, imagedisplay devices including the transparent laminates of various Examples,which included a capacitive input device as a constituent element, wereproduced by a known method.

<Evaluation of Capacitive Input Device and Image Display Device>

In the capacitive input devices and image display devices including thetransparent laminates of various Examples, warpage occurred to a reducedextent even after curing of the photosensitive transparent resin layer,there was no problem with lifting or peeling because of satisfactoryadhesiveness to the transparent film substrate, and image displaydevices having the resistance to moist heat after salt water applicationwere obtained.

In the capacitive input devices and the image display devices includingthe transparent laminates of Examples 1 to 31, which were preferredembodiments of the invention, there was no problem of the transparentelectrode pattern being visually recognized.

The photosensitive transparent resin layer, the second transparent resinlayer and the like did not have defects such as air bubbles, and imagedisplay devices having excellent display characteristics were obtained.

EXPLANATION OF REFERENCES

-   -   1: transparent substrate (transparent film substrate or front        face plate)    -   2: mask layer    -   3: transparent electrode pattern (first transparent electrode        pattern)    -   3 a: pad part    -   3 b: connection part    -   4: transparent electrode pattern (second transparent electrode        pattern)    -   5: insulating layer    -   6: metal wiring section    -   7: photosensitive transparent resin layer    -   8: opening    -   9: metal wiring section    -   10: capacitive input device    -   11: transparent film    -   12: second transparent resin layer    -   13: transparent laminate    -   14: partial region on metal wiring section    -   21: region in which transparent electrode pattern, second        transparent resin layer, and photosensitive transparent resin        layer are laminated in this order    -   22: non-patterned region    -   α: taper angle    -   26: temporary support    -   29: protective release layer (protective film)    -   30: transfer film    -   31: terminal of lead wiring    -   33: cured area of photosensitive transparent resin layer and        second transparent resin layer    -   34: opening corresponding to terminal of lead wiring (uncured        area of photosensitive transparent resin layer and second        transparent resin layer)

What is claimed is:
 1. A composition for forming a touch panel electrodeprotective film, the composition comprising: a compound represented byFormula 1 as Component A; a binder polymer as Component B; aphotopolymerization initiator as Component C; and a monomer having acarboxy group as Component D, wherein the content of Component A is 5%by mass or more and less than 50% by mass with respect to the total massof monomer components,Q²-R¹-Q¹  (1) in Formula 1, Q¹ and Q² each independently represent a(meth)acryloyloxy group, and R¹ represents a linear alkylene grouphaving 2 to 12 carbon atoms.
 2. The composition for forming a touchpanel electrode protective film according to claim 1, wherein thecontent of Component A is 10% to 40% by mass with respect to the totalmass of the monomer components.
 3. The composition for forming a touchpanel electrode protective film according to claim 1, wherein ComponentD is a (meth)acrylate compound having a carboxy group.
 4. Thecomposition for forming a touch panel electrode protective filmaccording to claim 1, wherein Component B is an acrylic resin having acarboxy group.
 5. A transfer film comprising: a temporary support; and aphotosensitive transparent resin layer formed from the composition forforming a touch panel electrode protective film according to claim
 1. 6.The transfer film according to claim 5, further comprising: a secondtransparent resin layer on the photosensitive transparent resin layer,wherein the second transparent resin layer has higher refractive indexthan the photosensitive transparent resin layer.
 7. A method for forminga protective film for a touch panel electrode, the method comprising:providing a photosensitive transparent resin layer on a base materialhaving a touch panel electrode, using the transfer film according toclaim 5; exposing at least a portion of the photosensitive transparentresin layer to actinic rays; and developing the exposed photosensitivetransparent resin layer, in this order.
 8. A transparent laminatecomprising: a touch panel electrode; a second transparent resin layerdisposed on the touch panel electrode; and a photosensitive transparentresin layer disposed on the second transparent resin layer, wherein thephotosensitive transparent resin layer is a layer obtained by curing thecomposition for forming a touch panel electrode protective filmaccording to claim 1, and the refractive index of the second transparentresin layer is higher than the refractive index of the photosensitivetransparent resin layer.
 9. A capacitive input device comprising: thetransparent laminate according to claim
 8. 10. An image display devicecomprising: the capacitive input device according to claim 9 as aconstituent element.
 11. A method for forming a protective film for atouch panel electrode, the method comprising: providing a photosensitivetransparent resin layer formed from the composition for forming a touchpanel electrode protective film according to claim 1, on a base materialhaving a touch panel electrode; exposing at least a portion of thephotosensitive transparent resin layer to actinic rays; and developingthe exposed photosensitive transparent resin layer, in this order.
 12. Aprotective film for a touch panel electrode, which is produced by themethod for forming a protective film for a touch panel electrodeaccording to claim
 11. 13. The composition for forming a touch panelelectrode protective film according to claim 1, wherein Component Cincludes an oxime ester compound and an α-aminoalkylphenon compound. 14.The composition for forming a touch panel electrode protective filmaccording to claim 1, wherein Component D includes at least one selectedfrom the group consisting of 2,2-tris(meth)acryloyloxy methylethylsuccinate, succinic acid ester of dipentaerythritol penta(meth)acrylate,succinic acid ester of pentaerythritol tri(meth)acrylate, phthalic acidester of pentaerythritol tri(meth)acrylate, and 2-(meth)acryloyloxyethyl succinate.
 15. The composition for forming a touch panel electrodeprotective film according to claim 1, wherein Component D includes atleast one selected from the group consisting of succinic acid ester ofdipentaerythritol penta(meth)acrylate, succinic acid ester ofpentaerythritol tri(meth)acrylate, and phthalic acid ester ofpentaerythritol tri(meth)acrylate.